JAJSNC7J November   1998  – November 2021 CD54HC138 , CD54HC238 , CD54HCT138 , CD54HCT238 , CD74HC138 , CD74HC238 , CD74HCT138 , CD74HCT238

PRODUCTION DATA  

  1. 1 特長
  2. 2 概要
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
    1.     5
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics (2)
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PW|16
  • NS|16
  • N|16
  • D|16
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC CD74HC(T)138, CD74HC(T)238 UNIT
N

(PDIP)

 D

(SOIC)

 NS

(SOP)

 PW

(TSSOP)
16 Pins 16 Pins 16 Pins 16 Pins
RθJA Junction-to-ambient thermal resistance(1) 67 73 64 108 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.