JAJSMB6A August 2019 – August 2024 CD54HCT08 , CD74HCT08
PRODUCTION DATA
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VCC | Supply voltage | –0.5 | 7 | V | |
IIK | Input clamp current(2) | VI < –0.5 V or VI > VCC + 0.5 V | ±20 | mA | |
IOK | Output clamp current(2) | VO < –0.5 V or VO > VCC + 0.5 V | ±20 | mA | |
IO | Continuous output current | VO > –0.5 V or VO < VCC + 0.5 V | ±25 | mA | |
Continuous current through VCC or GND | ±50 | mA | |||
TJ | Junction temperature(3) | Plastic package | 150 | °C | |
Hermetic package or die | 175 | °C | |||
Maximum lead temperature (soldering 10s) | SOIC - lead tips only | 300 | °C | ||
Tstg | Storage temperature | –65 | 150 | °C |