JAJSKP6A August   2021  – May 2022 CDCDB803

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Input
      2. 8.3.2 Output Enable Control
      3. 8.3.3 SMBus
        1. 8.3.3.1 SMBus Address Assignment
    4. 8.4 Device Functional Modes
      1. 8.4.1 CKPWRGD_PD# Function
      2. 8.4.2 OE[7:0]# and SMBus Output Enables
      3. 8.4.3 Output Slew Rate Control
      4. 8.4.4 Output Impedance Control
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 CDCDB803 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Enable Control Method
        2. 9.2.2.2 SMBus Address
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 TICS Pro
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) Device Package UNIT
RSL (QFN)
48 PINS
RθJA Junction-to-ambient thermal resistance 32.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 22.3 °C/W
RθJB Junction-to-board thermal resistance 14.3 °C/W
ΨJT Junction-to-top characterization parameter 0.5 °C/W
ΨJB Junction-to-board characterization parameter 14.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.