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This 25-V, 8-mΩ, 3.3-mm × 3.3-mm SON NexFET™ power MOSFET has been designed to minimize losses in power conversion applications.
TA = 25°C | TYPICAL VALUE | UNIT | ||
---|---|---|---|---|
VDS | Drain-to-Source Voltage | 25 | V | |
Qg | Gate Charge Total (4.5 V) | 2.9 | nC | |
Qgd | Gate Charge Gate-to-Drain | 0.7 | nC | |
RDS(on) | Drain-to-Source On Resistance | VGS = 4.5 V | 12 | mΩ |
VGS = 10 V | 8 | |||
VGS(th) | Threshold Voltage | 2 | V |
DEVICE | QTY | MEDIA | PACKAGE | SHIP |
---|---|---|---|---|
CSD16411Q3 | 2500 | 13-Inch Reel | SON 3.30-mm × 3.30-mm Plastic Package |
Tape and Reel |
CSD16411Q3T | 250 |
TA = 25°C | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-Source Voltage | 25 | V |
VGS | Gate-to-Source Voltage | +16 / –12 | V |
ID | Continuous Drain Current (Package Limited) | 60 | A |
Continuous Drain Current (Silicon Limited), TC = 25°C | 50 | ||
Continuous Drain Current(1) | 14 | ||
IDM | Pulsed Drain Current, TA = 25°C(2) | 130 | A |
PD | Power Dissipation(1) | 2.87 | W |
Power Dissipation, TC = 25°C | 35 | ||
TJ, TSTG |
Operating Junction Storage Temperature |
–55 to 150 | °C |
EAS | Avalanche Energy, Single Pulse ID = 18 A, L = 0.1 mH, RG = 25 Ω |
16 | mJ |
RDS(ON) vs VGS![]() |
Gate Charge![]() |
Changes from A Revision (September 2010) to B Revision
Changes from * Revision (August 2009) to A Revision
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
STATIC CHARACTERISTICS | |||||||
BVDSS | Drain-to-source voltage | VGS = 0 V, ID = 250 μA | 25 | V | |||
IDSS | Drain-to-source leakage current | VGS = 0 V, VDS = 20 V | 1 | μA | |||
IGSS | Gate-to-source leakage current | VDS = 0 V, VGS = +16 / –12 V | 100 | nA | |||
VGS(th) | Gate-to-source threshold voltage | VDS = VGS, ID = 250 μA | 1.7 | 2 | 2.3 | V | |
RDS(on) | Drain-to-source on resistance | VGS = 4.5 V, ID = 10 A | 12 | 15 | mΩ | ||
VGS = 10 V, ID = 10 A | 8 | 10 | |||||
gfs | Transconductance | VDS = 15 V, ID = 10 A | 30 | S | |||
DYNAMIC CHARACTERISTICS | |||||||
CISS | Input capacitance | VGS = 0 V, VDS = 12.5 V, f = 1 MHz | 440 | 570 | pF | ||
COSS | Output capacitance | 330 | 430 | pF | |||
CRSS | Reverse transfer capacitance | 33 | 43 | pF | |||
Rg | Series gate resistance | 0.8 | 1.6 | Ω | |||
Qg | Gate charge total (4.5 V) | VDS = 12.5 V, ID = 10 A | 2.9 | 3.8 | nC | ||
Qgd | Gate charge gate-to-drain | 0.7 | nC | ||||
Qgs | Gate charge gate-to-source | 1.5 | nC | ||||
Qg(th) | Gate charge at Vth | 0.9 | nC | ||||
QOSS | Output charge | VDS = 12.5 V, VGS = 0 V | 6.5 | nC | |||
td(on) | Turnon delay time | VDS = 12.5 V, VGS = 4.5 V, ID = 10 A RG = 2 Ω |
5.3 | ns | |||
tr | Rise time | 7.8 | ns | ||||
td(off) | Turnoff delay time | 6 | ns | ||||
tf | Fall time | 3.1 | ns | ||||
DIODE CHARACTERISTICS | |||||||
VSD | Diode forward voltage | IS = 10 A, VGS = 0 V | 0.85 | 1 | V | ||
Qrr | Reverse recovery charge | VDD = 12.5 V, IF = 10 A, di/dt = 300 A/μs | 11.7 | nC | |||
trr | Reverse recovery time | VDD = 12.5 V, IF = 10 A, di/dt = 300 A/μs | 15.5 | ns |
PARAMETER | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
R θJC | Junction-to-case thermal resistance(1) | 3.5 | °C/W | ||
R θJA | Junction-to-ambient thermal resistance(1) (2) | 55 | °C/W |
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Max RθJA = 55°C/W when mounted on 1-in2 of 2-oz Cu. |
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Max RθJA = 160°C/W when mounted on minimum pad area of 2-oz Cu. |
VDS = 12.5 V, ID = 10 A |
ID = 250 µA |
ID = 10 A, VGS = 10 V |