SLPS684 July   2017 CSD18511KTT

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 KTT Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Specifications

Electrical Characteristics

TA = 25°C (unless otherwise stated)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC CHARACTERISTICS
BVDSS Drain-to-source voltage VGS = 0 V, ID = 250 μA 40 V
IDSS Drain-to-source leakage current VGS = 0 V, VDS = 32 V 1 μA
IGSS Gate-to-source leakage current VDS = 0 V, VGS = 20 V 100 nA
VGS(th) Gate-to-source threshold voltage VDS = VGS, ID = 250 μA 1.5 1.8 2.4 V
RDS(on) Drain-to-source on-resistance VGS = 4.5 V, ID = 100 A 3.2 4.2
VGS = 10 V, ID = 100 A 2.1 2.6
gfs Transconductance VDS = 4 V, ID = 100 A 249 S
DYNAMIC CHARACTERISTICS
Ciss Input capacitance VGS = 0 V, VDS = 20 V, ƒ = 1 MHz 4570 5940 pF
Coss Output capacitance 454 591 pF
Crss Reverse transfer capacitance 235 306 pF
RG Series gate resistance 0.9 1.8 Ω
Qg Gate charge total (4.5 V) VDS = 20 V, ID = 100 A 31 nC
Qg Gate charge total (10 V) 64 nC
Qgd Gate charge gate-to-drain 9.7 nC
Qgs Gate charge gate-to-source 17.9 nC
Qg(th) Gate charge at Vth 7.4 nC
Qoss Output charge VDS = 20 V, VGS = 0 V 20.7 nC
td(on) Turnon delay time VDS = 20 V, VGS = 10 V,
IDS = 100 A, RG = 0 Ω
8 ns
tr Rise time 6 ns
td(off) Turnoff delay time 17 ns
tf Fall time 3 ns
DIODE CHARACTERISTICS
VSD Diode forward voltage ISD = 100 A, VGS = 0 V 0.9 1.0 V
Qrr Reverse recovery charge VDS= 20 V, IF = 100 A,
di/dt = 300 A/μs
62 nC
trr Reverse recovery time 31 ns

Thermal Information

TA = 25°C (unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJC Junction-to-case thermal resistance 0.8 °C/W
RθJA Junction-to-ambient thermal resistance 62 °C/W

Typical MOSFET Characteristics

TA = 25°C (unless otherwise stated)
CSD18511KTT D001_SLPS684.png
Figure 1. Transient Thermal Impedance
CSD18511KTT D002_SLPS684.gif
Figure 2. Saturation Characteristics
CSD18511KTT D003_SLPS684.gif
VDS = 5 V
Figure 3. Transfer Characteristics
CSD18511KTT D004_SLPS684.gif
VDS = 20 V ID = 100 A
Figure 4. Gate Charge
CSD18511KTT D006_SLPS684.gif
ID = 250 µA
Figure 6. Threshold Voltage vs Temperature
CSD18511KTT D008_SLPS684.gif
ID = 100 A
Figure 8. Normalized On-State Resistance vs Temperature
CSD18511KTT D010_SLPS684.gif
Single pulse, max RθJC = 0.8°C/W
Figure 10. Maximum Safe Operating Area
CSD18511KTT D012_SLPS684.gif
Max RθJC = 0.8°C/W
Figure 12. Maximum Drain Current vs Temperature
CSD18511KTT D005_SLPS684.gif
Figure 5. Capacitance
CSD18511KTT D007_SLPS684.gif
Figure 7. On-State Resistance vs Gate-to-Source Voltage
CSD18511KTT D009_SLPS684.gif
Figure 9. Typical Diode Forward Voltage
CSD18511KTT D011_SLPS684.gif
Figure 11. Single Pulse Unclamped Inductive Switching