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7.1 KTT Package Dimensions

Notes:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Features may not exist and shape may vary per different assembly sites.

7.2 Recommended PCB Pattern

For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques.

7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

Notes:

1. This package is designed to be soldered to a thermal pad on the board. See application notes, PowerPAD Thermally Enhanced Package (SLMA002) and PowerPAD Made Easy (SLMA004) for more information.
2. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
3. Board assembly site may have different recommendations for stencil design.