SLPS414B December 2013 – May 2017 CSD19532Q5B
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
STATIC CHARACTERISTICS | |||||||
BVDSS | Drain-to-Source Voltage | VGS = 0 V, ID = 250 μA | 100 | V | |||
IDSS | Drain-to-Source Leakage Current | VGS = 0 V, VDS = 80 V | 1 | μA | |||
IGSS | Gate-to-Source Leakage Current | VDS = 0 V, VGS = 20 V | 100 | nA | |||
VGS(th) | Gate-to-Source Threshold Voltage | VDS = VGS, ID = 250 μA | 2.2 | 2.6 | 3.2 | V | |
RDS(on) | Drain-to-Source On Resistance | VGS = 6 V, ID = 17 A | 4.6 | 5.7 | mΩ | ||
VGS = 10 V, ID = 17 A | 4 | 4.9 | mΩ | ||||
gfs | Transconductance | VDS = 50 V, ID = 17 A | 84 | S | |||
DYNAMIC CHARACTERISTICS | |||||||
Ciss | Input Capacitance | VGS = 0 V, VDS = 50 V, ƒ = 1 MHz | 3700 | 4810 | pF | ||
Coss | Output Capacitance | 706 | 918 | pF | |||
Crss | Reverse Transfer Capacitance | 14 | 18 | pF | |||
RG | Series Gate Resistance | 1.2 | 2.4 | Ω | |||
Qg | Gate Charge Total (10 V) | VDS = 50 V, ID = 17 A | 48 | 62 | nC | ||
Qgd | Gate Charge Gate to Drain | 8.7 | nC | ||||
Qgs | Gate Charge Gate to Source | 13 | nC | ||||
Qg(th) | Gate Charge at Vth | 9.5 | nC | ||||
Qoss | Output Charge | VDS = 50 V, VGS = 0 V | 128 | nC | |||
td(on) | Turn On Delay Time | VDS = 50 V, VGS = 10 V, IDS = 17 A, RG = 0 Ω |
7 | ns | |||
tr | Rise Time | 6 | ns | ||||
td(off) | Turn Off Delay Time | 22 | ns | ||||
tf | Fall Time | 6 | ns | ||||
DIODE CHARACTERISTICS | |||||||
VSD | Diode Forward Voltage | ISD = 17 A, VGS = 0 V | 0.8 | 1 | V | ||
Qrr | Reverse Recovery Charge | VDS= 50 V, IF = 17 A, di/dt = 300 A/μs |
249 | nC | |||
trr | Reverse Recovery Time | 80 | ns |
THERMAL METRIC | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
RθJC | Junction-to-Case Thermal Resistance(1) | 0.8 | °C/W | ||
RθJA | Junction-to-Ambient Thermal Resistance(1)(2) | 50 |
![]() |
Max RθJA = 50°C/W when mounted on 1 inch2 (6.45 cm2) of 2-oz. (0.071-mm thick) Cu. |
![]() |
Max RθJA = 125°C/W when mounted on a minimum pad area of 2-oz. (0.071-mm thick) Cu. |