JAJSNE0B January   2014  – March 2022 CSD25310Q2

PRODUCTION DATA  

  1. 1特長
  2. 2アプリケーション
  3. 3概要
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q2 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 Q2 Tape and Reel Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DQK|6
サーマルパッド・メカニカル・データ
発注情報

5.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJC Thermal Resistance Junction to Case(1) 4.5 °C/W
RθJA Thermal Resistance Junction to Ambient(1)(2) 55
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.

GUID-31EED1B7-C6B0-4C4B-935F-00ED95C0AEBE-low.gif
Max RθJA = 55 when mounted on 1 inch2 (6.45 cm2) of 2-oz. (0.071-mm thick) Cu.
GUID-DFDBACE5-2D31-4B29-8AFE-D7B47B388601-low.gif
Max RθJA = 215 when mounted on minimum pad area of 2-oz. (0.071-mm thick) Cu.