SLPS223F May 2010 – October 2016 CSD86350Q5D
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
DIM | MILLIMETERS | INCHES | ||
---|---|---|---|---|
MIN | MAX | MIN | MAX | |
a | 1.40 | 1.5 | 0.055 | 0.059 |
b | 0.360 | 0.460 | 0.014 | 0.018 |
c | 0.150 | 0.250 | 0.006 | 0.010 |
c1 | 0.150 | 0.250 | 0.006 | 0.010 |
d | 1.630 | 1.730 | 0.064 | 0.068 |
d1 | 0.280 | 0.380 | 0.011 | 0.015 |
d2 | 0.200 | 0.300 | 0.008 | 0.012 |
d3 | 0.291 | 0.391 | 0.012 | 0.015 |
D1 | 4.900 | 5.100 | 0.193 | 0.201 |
D2 | 4.269 | 4.369 | 0.168 | 0.172 |
E | 4.900 | 5.100 | 0.193 | 0.201 |
E1 | 5.900 | 6.100 | 0.232 | 0.240 |
E2 | 3.106 | 3.206 | 0.122 | 0.126 |
e | 1.27 TYP | 0.050 TYP | ||
f | 0.396 | 0.496 | 0.016 | 0.020 |
L | 0.510 | 0.710 | 0.020 | 0.028 |
θ | 0.00 | — | — | — |
K | 0.812 TYP | 0.032 TYP |
NOTE:
Dimensions are in mm (inches).
.
For recommended circuit layout for PCB designs, see Reducing Ringing Through PCB Layout Techniques (SLPA005).
NOTES:
1. 10-sprocket hole-pitch cumulative tolerance ±0.2.