JAJSD35E May   2017  – June 2024 CSD88584Q5DC

PRODUCTION DATA  

  1.   1
  2. 1特長
  3. 2アプリケーション
  4. 3概要
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Power Block Performance
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Typical Power Block Device Characteristics
    7. 4.7 Typical Power Block MOSFET Characteristics
  6. 5Application and Implementation
    1. 5.1 Application Information
    2. 5.2 Brushless DC Motor With Trapezoidal Control
    3. 5.3 Power Loss Curves
    4. 5.4 Safe Operating Area (SOA) Curve
    5. 5.5 Normalized Power Loss Curves
    6. 5.6 Design Example – Regulate Current to Maintain Safe Operation
    7. 5.7 Design Example – Regulate Board and Case Temperature to Maintain Safe Operation
      1. 5.7.1 Operating Conditions
      2. 5.7.2 Calculating Power Loss
      3. 5.7.3 Calculating SOA Adjustments
  7. 6Layout
    1. 6.1 Layout Guidelines
      1. 6.1.1 Electrical Performance
      2. 6.1.2 Thermal Considerations
    2. 6.2 Layout Example
  8. 7Device and Documentation Support
    1. 7.1 ドキュメントの更新通知を受け取る方法
    2. 7.2 サポート・リソース
    3. 7.3 Trademarks
    4. 7.4 静電気放電に関する注意事項
    5. 7.5 用語集
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4.4 Thermal Information

TJ = 25°C (unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJA Junction-to-ambient thermal resistance (min Cu)(2) 125 °C/W
Junction-to-ambient thermal resistance (max Cu)(2)(1) 50
RθJC Junction-to-case thermal resistance (top of package)(2) 2.1 °C/W
Junction-to-case thermal resistance (VIN pin)(2) 1.1
(1) Device mounted on FR4 material with 1in2 (6.45cm2) Cu.
(2) RθJC is determined with the device mounted on a 1in2 (6.45cm2), 2oz (0.071mm) thick Cu pad on a 1.5in × 1.5in
(3.81cm × 3.81cm), 0.06in (1.52mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board design.