JAJSD34C April 2017 – April 2018 CSD88599Q5DC
PRODUCTION DATA.
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The SOA curve in Figure 3 provides guidance on the temperature boundaries within an operating system by incorporating the thermal resistance and system power loss. This curve outlines the board and case temperatures required for a given load current. The area under the curve dictates the safe operating area. This curve is based on measurements made on a PCB design with dimensions of 4 in (W) × 3.5 in (L) × 0.062 in (H) and 6 copper layers of 2-oz copper thickness.