JAJSPK7 January   2023

PRODUCTION DATA  

  1. 1特長
  2. 2アプリケーション
  3. 3概要
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Documentation Support
      1. 5.1.1 Related Documentation
    2. 5.2 ドキュメントの更新通知を受け取る方法
    3. 5.3 サポート・リソース
    4. 5.4 Trademarks
    5. 5.5 静電気放電に関する注意事項
    6. 5.6 用語集
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3. 6.3 Mechanical Drawing
    4. 6.4 Recommended PCB Land Pattern
    5. 6.5 Recommended Stencil Opening
    6. 6.6 Alternate Industry Standard Compatible PCB Land Pattern
    7. 6.7 Alternate Industry Standard Compatible Stencil Opening

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • RRB|41
サーマルパッド・メカニカル・データ

6.3 Mechanical Drawing

GUID-CD1121BF-4664-4D97-BFEC-8E628A366621-low.png
  1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
  2. This drawing is subject to change without notice.
  3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.