JAJSSV2G March 2011 – January 2024 DAC3482
PRODUCTION DATA
THERMAL METRIC(1) | DAC3482 | UNIT | ||
---|---|---|---|---|
RKD PACKAGE (WQFN-MR) | ZAY PACKAGE (NFBGA) | |||
88 PIN | 196 BALL | |||
RθJA | Junction-to-ambient thermal resistance | 22.1 | 37.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 7.1 | 6.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 4.7 | 16.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.1 | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 4.6 | 16.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.6 | N/A | °C/W |