SLASE16B January   2014  – May 2014 DAC37J82 , DAC38J82

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  Digital Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Serdes Input
      2. 7.3.2  Serdes Rate
      3. 7.3.3  Serdes PLL
      4. 7.3.4  Serdes Equalizer
      5. 7.3.5  JESD204B Descrambler
      6. 7.3.6  JESD204B Frame Assembly
      7. 7.3.7  Serial Peripheral Interface (SPI)
      8. 7.3.8  Multi-Device Synchronization
      9. 7.3.9  Input Multiplexer
      10. 7.3.10 FIR Filters
      11. 7.3.11 Full Complex Mixer
      12. 7.3.12 Coarse Mixer
      13. 7.3.13 Dithering
      14. 7.3.14 Complex Summation
      15. 7.3.15 Quadrature Modulation Correction (QMC)
        1. 7.3.15.1 Gain and Phase Correction
        2. 7.3.15.2 Offset Correction
      16. 7.3.16 Group Delay Correction Block
        1. 7.3.16.1 Fine Fractional Delay FIR Filter
        2. 7.3.16.2 Coarse Fractional Delay FIR Filter
      17. 7.3.17 Output Multiplexer
      18. 7.3.18 Power Measurement And Power Amplifier Protection
      19. 7.3.19 Serdes Test Modes
      20. 7.3.20 Error Counter
      21. 7.3.21 Eye Scan
      22. 7.3.22 JESD204B Pattern Test
      23. 7.3.23 Temperature Sensor
      24. 7.3.24 Alarm Monitoring
      25. 7.3.25 LVPECL Inputs
      26. 7.3.26 CMOS Digital Inputs
      27. 7.3.27 Reference Operation
      28. 7.3.28 Analog Outputs
      29. 7.3.29 DAC Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Clocking Modes
        1. 7.4.1.1 PLL Bypass Mode
        2. 7.4.1.2 PLL Mode
      2. 7.4.2 PRBS Test Mode
    5. 7.5 Register Map
      1. 7.5.1 Register Descriptions
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-IF Wideband LTE Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Data Input Rate
          2. 8.2.1.2.2 Intermediate Frequency
          3. 8.2.1.2.3 Interpolation
          4. 8.2.1.2.4 DAC PLL Setup
          5. 8.2.1.2.5 Serdes Lanes
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Zero-IF Wideband Transmitter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Data Input Rate
          2. 8.2.2.2.2 Interpolation
          3. 8.2.2.2.3 Serdes Lanes
          4. 8.2.2.2.4 LO Feedthrough and Sideband Correction
        3. 8.2.2.3 Application Performance Plots
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

144-Ball Flip Chip BGA
AAV Package
(Top View)
po_lase16.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NUMBER
ALARM L8 O CMOS output for ALARM condition. The ALARM output functionality is defined through the config7 register. Default polarity is active high, but can be changed to active high via config0 alarm_out_pol control bit. If not used it can be left open.
AMUX0 H3 I/O Analog test pin for SerDes, Lane 0 to Lane 3. It can be left open if not used.
AMUX1 E3 I/O Analog test pin for SerDes, Lane 4 to Lane 7. It can be left open if not used.
ATEST K9 I/O Analog test pin for DAC, references and PLL. It can be left open if not used.
DACCLKP A10 I Positive LVPECL clock input for DAC core with Vcm = 0.5V. It can be PLL reference clock or external DAC sampling rate clock. If not used, DACCLK is self-biased with 100mV differential at Vcm = 0.5V.
DACCLKN A9 I Complementary LVPECL clock input for DAC core. (see the DACCLKP description)
EXTIO F10 I/O Used as external reference input when internal reference is disabled through config27 extref_ena = ‘1’. Used as internal reference output when config27 extref_ena = ‘0’ (default). Requires a 0.1 μF decoupling capacitor to analog GND when used as reference output. It can be left open if not used.
GND A12, F12, G12, M12, A11, B11, C11, D11, E11, F11, G11, H11, J11, K11, L11, M11, C8, D8, E8, F8, G8, H8, J8, E7, F7, G7, H7, E6, F6, G6, H6, A5, B5, E5, F5, G5, H5, A4, B4, M4, B3, C3, L3, B2, C2, D2, E2, H2, J2, K2, L2 I These pins are ground for all supplies.
IFORCE C5 I/O Analog test pin for on chip parametric. It can be left open if not used.
IOUTAP B12 O A-Channel DAC current output. Must tied to GND if not used.
IOUTAN C12 O A-Channel DAC complementary current output. Must tied to GND if not used.
IOUTBP E12 O B-Channel DAC current output. Must tied to GND if not used.
IOUTBN D12 O B-Channel DAC complementary current output. Must tied to GND if not used.
IOUTCP H12 O C-Channel DAC current output. Must tied to GND if not used.
IOUTCN J12 O C-Channel DAC complementary current output. Must tied to GND if not used.
IOUTDP L12 O D-Channel DAC current output. Must tied to GND if not used.
IOUTDN K12 O D-Channel DAC complementary current output. Must tied to GND if not used.
LPF C9 I/O External PLL loop filter connection. It can be left open if not used.
RBIAS G10 O Full-scale output current bias. Change the full-scale output current through coarse_dac(3:0). Expected to be 1.92kΩ to GND.
RESETB K8 I Active low input for chip RESET, which resets all the programming registers to their default state. Internal pull-up. It can be left open if not used.
RX0P G1 I CML SerDes interface lane 0 input, positive, expected to be AC coupled. It can be left open if not used.
RX0N H1 I CML SerDes interface lane 0 input, negative, expected to be AC coupled. It can be left open if not used.
RX1P K1 I CML SerDes interface lane 1 input, positive, expected to be AC coupled. It can be left open if not used.
RX1N J1 I CML SerDes interface lane 1 input, negative, expected to be AC coupled. It can be left open if not used.
RX2P L1 I CML SerDes interface lane 2 input, positive, expected to be AC coupled. It can be left open if not used.
RX2N M1 I CML SerDes interface lane 2 input, negative, expected to be AC coupled. It can be left open if not used.
RX3P M3 I CML SerDes interface lane 3 input, positive, expected to be AC coupled. It can be left open if not used.
RX3N M2 I CML SerDes interface lane 3 input, negative, expected to be AC coupled. It can be left open if not used.
RX4P F1 I CML SerDes interface lane 4 input, positive, expected to be AC coupled. It can be left open if not used.
RX4N E1 I CML SerDes interface lane 4 input, negative, expected to be AC coupled. It can be left open if not used.
RX5P C1 I CML SerDes interface lane 5 input, positive, expected to be AC coupled. It can be left open if not used.
RX5N D1 I CML SerDes interface lane 5 input, negative, expected to be AC coupled. It can be left open if not used.
RX6P B1 I CML SerDes interface lane 6 input, positive, expected to be AC coupled. It can be left open if not used.
RX6N A1 I CML SerDes interface lane 6 input, negative, expected to be AC coupled. It can be left open if not used.
RX7P A3 I CML SerDes interface lane 7 input, positive, expected to be AC coupled. It can be left open if not used.
RX7N A2 I CML SerDes interface lane 7 input, negative, expected to be AC coupled. It can be left open if not used.
SYSREFP A7 I LVPECL SYSREF positive input with Vcm = 0.5V. This positive/negative pair is captured with the rising edge of DACCLKP/N. It is used for JESD204B Subclass 1 deterministic latency and multiple DAC synchronization, which can be periodic or pulsed. If not used, it is self-biased with 100mV differential at Vcm = 0.5V.
SYSREFN A6 I LVPECL SYSREF negative input with Vcm = 0.5V. (See the SYSREFP description)
SCLK L9 I Serial interface clock. Internal pull-down. It can be left open if not used.
SDENB M9 I Active low serial data enable, always an input to the DAC37J82/DAC38J82. Internal pull-up. It can be left open if not used.
SDIO L10 I/O Serial interface data. Bi-directional in 3-pin mode (default) and 4-pin mode. Internal pull-down. It can be left open if not used.
SDO M10 O Uni-directional serial interface data in 4-pin mode. The SDO pin is tri-stated in 3-pin interface mode (default). It can be left open if not used.
SLEEP M8 I Active high asynchronous hardware power-down input. Internal pull-down. It can be left open if not used.
SYNCBP B7 O Synchronization request to transmitter, LVDS positive output. It can be left open if not used.
SYNCBN B6 O Synchronization request to transmitter, LVDS negative output. It can be left open if not used.
SYNC_N_AB L6 O Synchronization request to transmitter, CMOS output. Defaults to link 0, but can be programmable for any link. It can be left open if not used.
SYNC_N_CD L7 O Synchronization request to transmitter, CMOS output. Defaults to link 1, but can be programmable for any link. It can be left open if not used.
TCLK K4 I JTAG test clock. It can be left open if not used.
TDI L5 I JTAG test data in. It can be left open if not used.
TDO M5 O JTAG test data out. It can be left open if not used.
TMS L4 I JTAG test mode select. It can be left open if not used.
TRSTB J3 I JTAG test reset. Must be tied to GND to hold the JTAG state machine status reset if the JTAG port is not used.
TXENABLE K5 I To enable analog output data transmission, set sif_txenable in register config3 to “1” or pull CMOS TXENABLE pin to high. Transmit enable active high input. Internal pull-down. To disable analog output, set sif_txenable to “0” and pull CMOS TXENABLE pin to low. The DAC output is forced to midscale. It can be left open if not used.
TESTMODE K3 O This pin is used for factory testing. Internal pull-down. It can be left open if not used.
VDDADAC33 D10, E10, H10, J10, I Analog supply voltage. (3.3V)
VDDAPLL18 B10, B9 I PLL analog supply voltage. (1.8V)
VDDAREF18 C10, K10 I Analog reference supply voltage (1.8V)
VDDCLK09 A8, B8 I Internal clock buffer supply voltage (0.9V). It is recommended to isolate this supply from VDDDIG09.
VDDDAC09 D9, E9, F9, G9, H9, J9 I DAC core supply voltage. (0.9V). It is recommended to isolate this supply from VDDDIG09.
VDDDIG09 J7, J6, D5, J5, D4, E4, F4, G4, H4, J4, D3 I Digital supply voltage. (0.9V). It is recommended to isolate this supply from VDDCLK09 and VDDDAC09.
VDDIO18 K7, K6 I Supply voltage for all digital I/O and CMOS I/O. (1.8V)
VDDR18 F2, G2 I Supply voltage for SerDes (1.8V)
VDDS18 C7, C6 I Supply voltage for LVDS SYNCBP/N (1.8V)
VDDT09 F3, G3 I Supply voltage for SerDes termination (0.9V)
VQPS18 D7, D6 I Fuse supply voltage. This supply pin is also used for factory fuse programming. Connect to 1.8V.
VSENSE C4 I/O Analog test pin for on chip parametric. It can be left open if not used.