JAJSRY8A November   2023  – March 2024 DAC39RF12 , DAC39RFS12

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - AC Specifications
    7. 6.7  Electrical Characteristics - Power Consumption
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 SPI and FRI Timing Diagrams
    11. 6.11 Typical Characteristics: Bandwidth and DC Linearity
    12. 6.12 Typical Characteristics: Single Tone Spectra
    13. 6.13 Typical Characteristics: Dual Tone Spectra
    14. 6.14 Typical Characteristics: Noise Spectral Density
    15. 6.15 Typical Characteristics: Linearity Sweeps
    16. 6.16 Typical Characteristics: Modulated Waveforms
    17. 6.17 Typical Characteristics: Phase and Amplitude Noise
    18. 6.18 Typical Characteristics: Power Dissipation and Supply Currents
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RTZ Mode
        3. 7.3.1.3 RF Mode
        4. 7.3.1.4 DES Mode
      2. 7.3.2 DAC Core
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-Scale Current Adjustment
      3. 7.3.3 DEM and Dither
      4. 7.3.4 Offset Adjustment
      5. 7.3.5 Clocking Subsystem
        1. 7.3.5.1 SYSREF Frequency Requirements
        2. 7.3.5.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      6. 7.3.6 Digital Signal Processing Blocks
        1. 7.3.6.1 Digital Upconverter (DUC)
          1. 7.3.6.1.1 Interpolation Filters
          2. 7.3.6.1.2 Numerically Controlled Oscillator (NCO)
            1. 7.3.6.1.2.1 Phase-Continuous NCO Update Mode
            2. 7.3.6.1.2.2 Phase-coherent NCO Update Mode
            3. 7.3.6.1.2.3 Phase-sync NCO Update Mode
            4. 7.3.6.1.2.4 NCO Synchronization
              1. 7.3.6.1.2.4.1 JESD204C LSB Synchonization
            5. 7.3.6.1.2.5 NCO Mode Programming
          3. 7.3.6.1.3 Mixer Scaling
        2. 7.3.6.2 Channel Bonder
        3. 7.3.6.3 DES Interpolator
      7. 7.3.7 JESD204C Interface
        1. 7.3.7.1  Deviation from JESD204C Standard
        2. 7.3.7.2  Transport Layer
        3. 7.3.7.3  Scrambler and Descrambler
        4. 7.3.7.4  Link Layer
        5. 7.3.7.5  Physical Layer
        6. 7.3.7.6  Serdes PLL Control
        7. 7.3.7.7  Serdes Crossbar
        8. 7.3.7.8  Multi-Device Synchronization and Deterministic Latency
          1. 7.3.7.8.1 Programming RBD
        9. 7.3.7.9  Operation in Subclass 0 Systems
        10. 7.3.7.10 Link Reset
      8. 7.3.8 Alarm Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 DUC and DDS Modes
      2. 7.4.2 JESD204C Interface Modes
        1. 7.4.2.1 JESD204C Interface Modes
        2. 7.4.2.2 JESD204C Format Diagrams
          1. 7.4.2.2.1 16-bit Formats
          2. 7.4.2.2.2 12-bit Formats
          3. 7.4.2.2.3 8-bit Formats
      3. 7.4.3 NCO Synchronization Latency
      4. 7.4.4 Data Path Latency
    5. 7.5 Programming
      1. 7.5.1 Using the Standard SPI Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Serial Interface Protocol
        6. 7.5.1.6 Streaming Mode
      2. 7.5.2 Using the Fast Reconfiguration Interface
      3. 7.5.3 SPI Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Startup Procedure for DUC/Bypass Mode
      2. 8.1.2 Startup Procedure for DDS Mode
      3. 8.1.3 Eye Scan Procedure
      4. 8.1.4 Pre/Post Cursor Analysis Procedure
      5. 8.1.5 Understanding Dual Edge Sampling Modes
      6. 8.1.6 Sleep and Disable Modes
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Transmitter Design Procedure
        1. 8.2.2.1 Detailed Clocking Subsystem Design Procedure
          1. 8.2.2.1.1 Example 1: SWAP-C Optimized
          2. 8.2.2.1.2 Example 2: Improved Phase Noise LMX2820 with External VCO
          3. 8.2.2.1.3 Example 3: Discrete Analog PLL for Best DAC Performance
          4. 8.2.2.1.4 12 GHz Clock Generation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up and Down Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines and Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 商標
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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発注情報

8 Application and Implementation

Note:

以下のアプリケーション情報は、TI の製品仕様に含まれるものではなく、TI ではその正確性または完全性を保証いたしません。個々の目的に対する製品の適合性については、お客様の責任で判断していただくことになります。お客様は自身の設計実装を検証しテストすることで、システムの機能を確認する必要があります。