JAJSI90A November   2019  – April 2020 DAC60502 , DAC70502 , DAC80502

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      機能ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Timing Requirements : SPI Mode
    7. 8.7  Timing Requirements : I2C Standard Mode
    8. 8.8  Timing Requirements : I2C Fast Mode
    9. 8.9  Timing Requirements : I2C Fast-Mode Plus
    10. 8.10 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 9.3.1.1 DAC Transfer Function
        2. 9.3.1.2 DAC Register Structure
        3. 9.3.1.3 Output Amplifier
      2. 9.3.2 Internal Reference
        1. 9.3.2.1 Solder Heat Reflow
      3. 9.3.3 Power-On Reset (POR)
      4. 9.3.4 Software Reset
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Mode
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 SPI Mode
          1. 9.5.1.1.1 SYNC Interrupt
        2. 9.5.1.2 I2C Mode
          1. 9.5.1.2.1 F/S Mode Protocol
          2. 9.5.1.2.2 DACx0502 I2C Update Sequence
            1. 9.5.1.2.2.1 DACx0502 Address Byte
            2. 9.5.1.2.2.2 DACx0502 Command Byte
            3. 9.5.1.2.2.3 DACx0502 Data Byte (MSDB and LSDB)
          3. 9.5.1.2.3 DACx0502 I2C Read Sequence
    6. 9.6 Register Maps
      1. 9.6.1 Registers
        1. 9.6.1.1 NOOP Register (offset = 0h) [reset = 0000h]
          1. Table 9. NOOP Register Field Descriptions
        2. 9.6.1.2 DEVID Register (offset = 1h) [reset = 0214h for DAC80502, 1214h for DAC70502, 2214h for DAC60502]
          1. Table 10. DEVID Register Field Descriptions
        3. 9.6.1.3 SYNC Register (offset = 2h) [reset = 0300h]
          1. Table 11. SYNC Register Field Descriptions
        4. 9.6.1.4 CONFIG Register (offset = 3h) [reset = 0000h]
          1. Table 12. CONFIG Register Field Descriptions
        5. 9.6.1.5 GAIN Register (offset = 4h) [reset = 0003h]
          1. Table 13. GAIN Register Field Descriptions
        6. 9.6.1.6 TRIGGER Register (offset = 5h) [reset = 0000h]
          1. Table 14. TRIGGER Register Field Descriptions
        7. 9.6.1.7 BRDCAST Register (offset = 6h) [reset = 0000h for RSTSEL = 0, or reset = 8000h for RSTSEL = 1]
          1. Table 15. BRDCAST Register Field Descriptions
        8. 9.6.1.8 STATUS Register (offset = 7h) [reset = 0000h]
          1. Table 16. STATUS Register Field Descriptions
        9. 9.6.1.9 DAC-n Register (offset = 8h–9h) [reset = 0000h for RSTSEL = 0, or reset = 8000h for RSTSEL = 1]
          1. Table 17. DAC-A Data Register Field Descriptions (8h)
          2. Table 18. DAC-B Data Register Field Descriptions (9h)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 SPI Connection to a Processor
      2. 10.3.2 I2C Interface Connection to a Processor
    4. 10.4 What To Do and What Not To Do
      1. 10.4.1 What To Do
      2. 10.4.2 What Not To Do
    5. 10.5 Initialization Setup
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
      1. 13.1.1 関連資料
    2. 13.2 関連リンク
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 サポート・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4 Thermal Information

THERMAL METRIC(1) DACx0502 UNIT
DRX (WSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 99.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.9 °C/W
RθJB Junction-to-board thermal resistance 35.9 °C/W
ΨJT Junction-to-top characterization parameter 1.7 °C/W
ΨJB Junction-to-board characterization parameter 35.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.