JAJSFQ0A July   2018  – November 2018 DAC61408 , DAC71408 , DAC81408

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      機能ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Digital-to-Analog Converters (DACs) Architecture
        1. 10.3.1.1 DAC Transfer Function
        2. 10.3.1.2 DAC Register Structure
          1. 10.3.1.2.1 DAC Register Synchronous and Asynchronous Updates
          2. 10.3.1.2.2 Broadcast DAC Register
          3. 10.3.1.2.3 Clear DAC Operation
      2. 10.3.2 Internal Reference
      3. 10.3.3 Device Reset Options
        1. 10.3.3.1 Power-on-Reset (POR)
        2. 10.3.3.2 Hardware Reset
        3. 10.3.3.3 Software Reset
      4. 10.3.4 Thermal Protection
        1. 10.3.4.1 Analog Temperature Sensor: TEMPOUT Pin
        2. 10.3.4.2 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Toggle Mode
      2. 10.4.2 Differential Mode
      3. 10.4.3 Power-Down Mode
    5. 10.5 Programming
      1. 10.5.1 Stand-Alone Operation
        1. 10.5.1.1 Streaming Mode Operation
      2. 10.5.2 Daisy-Chain Operation
      3. 10.5.3 Frame Error Checking
    6. 10.6 Register Maps
      1. 10.6.1  NOP Register (Offset = 00h) [reset = 0000h]
        1. Table 9. NOP Register Field Descriptions
      2. 10.6.2  DEVICEID Register (Offset = 01h) [reset = ----h]
        1. Table 10. DEVICEID Register Field Descriptions
      3. 10.6.3  STATUS Register (Offset = 02h) [reset = 0000h]
        1. Table 11. STATUS Register Field Descriptions
      4. 10.6.4  SPICONFIG Register (Offset = 03h) [reset = 0A24h]
        1. Table 12. SPICONFIG Register Field Descriptions
      5. 10.6.5  GENCONFIG Register (Offset = 04h) [reset = 7F00h]
        1. Table 13. GENCONFIG Register Field Descriptions
      6. 10.6.6  BRDCONFIG Register (Offset = 05h) [reset = FFFFh]
        1. Table 14. BRDCONFIG Register Field Descriptions
      7. 10.6.7  SYNCCONFIG Register (Offset = 06h) [reset = 0000h]
        1. Table 15. SYNCCONFIG Register Field Descriptions
      8. 10.6.8  TOGGCONFIG0 Register (Offset = 07h) [reset = 0000h]
        1. Table 16. TOGGCONFIG0 Register Field Descriptions
      9. 10.6.9  TOGGCONFIG1 Register (Offset = 08h) [reset = 0000h]
        1. Table 17. TOGGCONFIG1 Register Field Descriptions
      10. 10.6.10 DACPWDWN Register (Offset = 09h) [reset = FFFFh]
        1. Table 18. DACPWDWN Register Field Descriptions
      11. 10.6.11 DACRANGEn Register (Offset = 0Bh - 0Ch) [reset = 0000h]
        1. Table 19. DACRANGEn Register Field Descriptions
      12. 10.6.12 TRIGGER Register (Offset = 0Eh) [reset = 0000h]
        1. Table 20. TRIGGER Register Field Descriptions
      13. 10.6.13 BRDCAST Register (Offset = 0Fh) [reset = 0000h]
        1. Table 21. BRDCAST Register Field Descriptions
      14. 10.6.14 DACn Register (Offset = 14h - 1Bh) [reset = 0000h]
        1. Table 22. DACn Register Field Descriptions
      15. 10.6.15 OFFSETn Register (Offset = 21h - 22h) [reset = 0000h]
        1. Table 23. OFFSETn Register Field Descriptions
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure for Remote Ground Tracking
        1. 11.2.2.1 Generating 300mV Offset
        2. 11.2.2.2 Amplifier Selection
        3. 11.2.2.3 Passive Component Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14デバイスおよびドキュメントのサポート
    1. 14.1 ドキュメントのサポート
    2. 14.2 関連リンク
    3. 14.3 ドキュメントの更新通知を受け取る方法
    4. 14.4 コミュニティ・リソース
    5. 14.5 商標
    6. 14.6 静電気放電に関する注意事項
    7. 14.7 Glossary
  15. 15メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.2.1 Design Requirements

In ATE and Motor Control applications, typically the systems are designed modular wherein the control module is located spatially away from the Device Under Test (DUT) module. Such a scheme allows ground potentials across modules to vary due to the impedance of the interconnects. This ground potential variation, in turn introduces inaccuracies to the DAC output when measured with respect to the remote or DUT ground. Figure 67 provides a method to compensate the variations in the remote ground. The ground variation in such applications is typically within ±300 mV that includes DC and 50 Hz/60 Hz mains frequency components. While the best way to handle this variation is to put opamps in level shifter configuration at each output, a low cost and low footprint solution is always preferable. The following sections focus on the latter approach.