JAJSF31B November 2017 – June 2019 DLP3030-Q1
PRODUCTION DATA.
NOTE
Calculation is not valid for a headlight application utilizing an optically underfilled active array. Contact TI Applications Engineering for array temperature calculation methods for headlight applications.
Active array temperature can be computed analytically from measurement points on the outside of the package, the package thermal resistance, the electrical power, and the illumination heat load.
Relationship between array temperature and the reference ceramic temperature (thermocouple location TP1 in Figure 12) is provided by the following equations.
where
Electrical power dissipation of the DMD is variable and depends on the voltages, data rates and operating frequencies.
Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source.
Equations shown previous are valid for a 1-Chip DMD system with total projection efficiency from DMD to the screen of 87%.
The constant CL2W is based on the DMD array characteristics. It assumes a spectral efficiency of 300 lumens/watt for the projected light and illumination distribution of 83.7% on the active array, and 16.3% on the array border.
Sample calculation: