JAJSH82A April   2019  – September 2019 DLP3034-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      DLP DLP3034-Q1 のブロック・システム図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
      7. 7.3.7 DMD JTAG Interface
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 Micromirror Array Temperature Calculation
    6. 7.6 Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Application Mission Profile Consideration
    4. 8.4 Illumination Mission Profile Considerations
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
    3. 10.3 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デバイスの項目表記
      2. 11.1.2 デバイスのマーキング
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 デバイスの取り扱い
    8. 11.8 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.5 Micromirror Array Temperature Calculation

Active array temperature can be computed analytically from measurement points on the outside of the package, the package thermal resistance, the electrical power, and the illumination heat load.

Relationship between array temperature and the reference ceramic temperature (thermocouple location TP1 in Figure 17) is provided by the following equations.

Equation 1. TARRAY = TCERAMIC + (QARRAY × RARRAY-TO-CERAMIC)
Equation 2. QARRAY = QELECTRICAL+ ( QINCIDENT × DMD Absorption Constant)

where

  • TARRAY = computed DMD array temperature (°C)
  • TCERAMIC = measured ceramic temperature (TP1 location in Figure 17) (°C)
  • RARRAY-TO-CERAMIC = DMD package thermal resistance from array to TP1 (°C/watt) (see Thermal Information)
  • QARRAY = total power, electrical plus absorbed, on the DMD array (watts)
  • QELECTRICAL = nominal electrical power dissipation by the DMD (watts)
  • QINCIDENT = incident optical power to DMD (watts)
  • DMD Absorption Constant = 0.42

Electrical power dissipation of the DMD is variable and depends on the voltages, data rates and operating frequencies.

Absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source.

Equations shown previous are valid for a 1-chip DMD system with illumination distribution of 83.7% on the active array and 16.3% on the array border.

Sample calculation:

  • QELECTRICAL = 0.105 W
  • TCERAMIC = 55°C
  • QINCIDENT = 3 W
    • Equation 3. QARRAY = 0.105 W + (3 W × 0.42) = 1.37 W
    Equation 4. TARRAY = 55°C + (1.37 W × 2.5°C/W) = 58.4°C

DLP3034-Q1 thermocouple_locations.gifFigure 17. Thermocouple Locations