JAJSPI5A
December 2022 – February 2024
DLP4621-Q1
PRODUCTION DATA
1
1
特長
2
アプリケーション
3
概要
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Storage Conditions
5.3
ESD Ratings
5.4
Recommended Operating Conditions
5.4.1
Illumination Overfill Diagram
5.5
Thermal Information
5.6
Electrical Characteristics
5.7
Timing Requirements
Electrical and Timing Diagrams
5.8
Switching Characteristics
5.8.1
LPSDR and Test Load Circuit Diagrams
5.9
System Mounting Interface Loads
System Interface Loads Diagram
5.10
Micromirror Array Physical Characteristics
5.10.1
Micromirror Array Physical Characteristics Diagram
5.11
Micromirror Array Optical Characteristics
5.12
Window Characteristics
5.13
Chipset Component Usage Specification
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
SubLVDS Data Interface
6.3.2
Low Speed Interface for Control
6.3.3
DMD Voltage Supplies
6.3.4
Asynchronous Reset
6.3.5
Temperature Sensing Diode
6.3.5.1
Temperature Sense Diode Theory
6.4
System Optical Considerations
6.4.1
Numerical Aperture and Stray Light Control
6.4.2
Pupil Match
6.4.3
Illumination Overfill
6.5
DMD Image Performance Specification
6.6
Micromirror Array Temperature Calculation
6.6.1
Monitoring Array Temperature Using the Temperature Sense Diode
6.7
Micromirror Landed-On/Landed-Off Duty Cycle
6.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Application Overview
7.2.2
Input Image Resolution
7.2.3
Reference Design
7.2.4
Application Mission Profile Consideration
7.3
Power Supply Recommendations
7.3.1
Power Supply Power-Up Procedure
7.3.2
Power Supply Power-Down Procedure
7.3.3
Power Supply Sequencing Requirements
7.4
Layout Guidelines
7.5
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Device Nomenclature
8.1.2
Device Markings
8.2
サード・パーティ製品に関する免責事項
8.3
ドキュメントの更新通知を受け取る方法
8.4
サポート・リソース
8.5
Trademarks
8.6
静電気放電に関する注意事項
8.7
DMD Handling
8.8
用語集
9
Revision History
10
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
FQX|120
MCLG047B
サーマルパッド・メカニカル・データ
発注情報
jajspi5a_oa
jajspi5a_pm
8.8
用語集
テキサス・インスツルメンツ用語集
この用語集には、用語や略語の一覧および定義が記載されています。