JAJSPI5B December   2022  – August 2024 DLP4621-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
      1. 5.4.1 Illumination Overfill Diagram
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements
      1.      Electrical and Timing Diagrams
    8. 5.8  Switching Characteristics
      1. 5.8.1 LPSDR and Test Load Circuit Diagrams
    9. 5.9  System Mounting Interface Loads
      1.      System Interface Loads Diagram
    10. 5.10 Micromirror Array Physical Characteristics
      1. 5.10.1 Micromirror Array Physical Characteristics Diagram
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 SubLVDS Data Interface
      2. 6.3.2 Low Speed Interface for Control
      3. 6.3.3 DMD Voltage Supplies
      4. 6.3.4 Asynchronous Reset
      5. 6.3.5 Temperature Sensing Diode
        1. 6.3.5.1 Temperature Sense Diode Theory
    4. 6.4 System Optical Considerations
      1. 6.4.1 Numerical Aperture and Stray Light Control
      2. 6.4.2 Pupil Match
      3. 6.4.3 Illumination Overfill
    5. 6.5 DMD Image Performance Specification
    6. 6.6 Micromirror Array Temperature Calculation
      1. 6.6.1 Monitoring Array Temperature Using the Temperature Sense Diode
    7. 6.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application Overview
      2. 7.2.2 Input Image Resolution
      3. 7.2.3 Reference Design
      4. 7.2.4 Application Mission Profile Consideration
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Power-Up Procedure
      2. 7.3.2 Power Supply Power-Down Procedure
      3. 7.3.3 Power Supply Sequencing Requirements
    4. 7.4 Layout Guidelines
    5. 7.5 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Device Markings
    2. 8.2 サード・パーティ製品に関する免責事項
    3. 8.3 ドキュメントの更新通知を受け取る方法
    4. 8.4 サポート・リソース
    5. 8.5 Trademarks
    6. 8.6 静電気放電に関する注意事項
    7. 8.7 DMD Handling
    8. 8.8 用語集
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • FQX|120
サーマルパッド・メカニカル・データ
発注情報

Overview

The DLP4621-Q1 automotive DMD consists of 921600 highly reflective, digitally switchable, micrometer-sized mirrors organized in a two-dimensional array. As shown in Figure 6-13, the micromirror array consists of 960 micromirror columns × 960 micromirror rows in a diamond pixel configuration with a 2:1 aspect ratio.

Around the perimeter of the 960 × 960 array of micromirrors is a uniform band of border micromirrors called the Pond of Micromirrors (POM). The border micromirrors are not user-addressable. The border micromirrors land in the –12° position once power has been applied to the device. There are 10 border micromirrors on each side of the 960 × 960 active array.

Due to the diamond pixel configuration, the columns of each odd row are offset by half a pixel from the columns of the even row. Each mirror is switchable between two discrete angular positions: –12° and +12°. The mirrors are illuminated from the bottom, which allows for compact and efficient system optical design.

For more information on supported resolutions and associated processing with DLPC231-Q1, refer to DLPC230-Q1 Programmer's Guide for Light Control Applications.