JAJSGI1B November   2018  – May 2022 DLP4710

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
    14. 6.14 Software Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Optical Interface and System Image Quality
        1. 7.5.1.1 Numerical Aperture and Stray Light Control
        2. 7.5.1.2 Pupil Match
        3. 7.5.1.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On and Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Micromirror Array Temperature Calculation

GUID-8A1C7D11-9FE3-4FBD-B341-811E07E7AC1F-low.gif Figure 7-1 DMD Thermal Test Points

Micromirror array temperature can be computed analytically from measurement points on the outside of the package, the ceramic package thermal resistance, the electrical power dissipation, and the illumination heat load. The relationship between micromirror array temperature and the reference ceramic temperature is provided by the following equations:

Equation 1. TARRAY = TCERAMIC + (QARRAY × RARRAY–TO–CERAMIC)
Equation 2. QARRAY = QELECTRICAL + QILLUMINATION
Equation 3. QILLUMINATION = (CL2W × SL)

where

  • TARRAY = Computed DMD array temperature (°C)
  • TCERAMIC = Measured ceramic temperature (°C), TP1 location in Figure 7-1
  • RARRAY–TO–CERAMIC = DMD package thermal resistance from array to outside ceramic (°C/W) specified in Section 6.5
  • QARRAY = Total DMD power; electrical plus absorbed (calculated) (W)
  • QELECTRICAL = Nominal DMD electrical power dissipation (W)
  • CL2W = Conversion constant for screen lumens to absorbed optical power on the DMD (W/lm) specified below
  • SL = Measured ANSI screen lumens (lm)

The electrical power dissipation of the DMD varies and depends on the voltages, data rates and operating frequencies. Use a nominal electrical power dissipation of 0.25 W to calculate array temperature. Absorbed optical power from the illumination source varies and depends on the operating state of the micromirrors and the intensity of the light source. Equations shown above are valid for a 1-chip DMD system with total projection efficiency through the projection lens from DMD to the screen of 87%.

The conversion constant CL2W is based on the DMD micromirror array characteristics. The conversion constant assumes a spectral efficiency of 300 lm/W for the projected light and illumination distribution of 83.7% on the DMD active array, and 16.3% on the DMD array border and window aperture. The conversion constant is calculated to be 0.00266 W/lm.

The following is a sample calculation for typical projection application:

TCERAMIC = 55°C (measured)
SL = 1500 lm (measured)
QELECTRICAL = 0.25 W
CL2W = 0.00266 W/lm
QARRAY = 0.25 W + (0.00266 W/lm × 1500 lm) = 4.24 W
TARRAY = 55°C + (4.24 W × 1.1°C/W) = 59.66°C