JAJSUI1
May 2024
DLP472TE
ADVANCE INFORMATION
1
1
特長
2
アプリケーション
3
概要
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Storage Conditions
5.3
ESD Ratings
5.4
Recommended Operating Conditions
11
12
5.5
Thermal Information
5.6
Electrical Characteristics
5.7
Switching Characteristics
5.8
Timing Requirements
5.9
System Mounting Interface Loads
5.10
Micromirror Array Physical Characteristics
5.11
Micromirror Array Optical Characteristics
5.12
Window Characteristics
5.13
Chipset Component Usage Specification
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Power Interface
6.3.2
Timing
6.4
Device Functional Modes
6.5
Optical Interface and System Image Quality Considerations
6.5.1
Numerical Aperture and Stray Light Control
6.5.2
Pupil Match
6.5.3
Illumination Overfill
6.6
Micromirror Array Temperature Calculation
6.7
Micromirror Power Density Calculation
6.8
Window Aperture Illumination Overfill Calculation
6.9
Micromirror Landed-On/Landed-Off Duty Cycle
6.9.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
6.9.2
Landed Duty Cycle and Useful Life of the DMD
6.9.3
Landed Duty Cycle and Operational DMD Temperature
6.9.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.3
Application Curve
7.3
Temperature Sensor Diode
8
Power Supply Recommendations
8.1
DMD Power Supply Power-Up Procedure
8.2
DMD Power Supply Power-Down Procedure
9
Layout
9.1
Layout Guidelines
9.2
Impedance Requirements
9.3
Layers
9.4
Trace Width, Spacing
9.5
Power
9.6
Trace Length Matching Recommendations
10
Device and Documentation Support
10.1
サード・パーティ製品に関する免責事項
10.2
Device Support
10.2.1
Device Nomenclature
10.2.2
Device Markings
10.3
Documentation Support
10.3.1
Related Documentation
10.4
Receiving Notification of Documentation Updates
10.5
サポート・リソース
10.6
Trademarks
10.7
静電気放電に関する注意事項
10.8
用語集
11
Revision History
12
Mechanical, Packaging, and Orderable Information
12.1
Package Option Addendum
12.1.1
Packaging Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
FYW|149
サーマルパッド・メカニカル・データ
発注情報
jajsui1_oa
6.3
Feature Description