Thermal Resistance,
active area to test point 1 (TP1)(1)(2)
1.0
°C/W
(1) The DMD
is designed to conduct absorbed and dissipated heat to the
back of the package. The cooling system must be capable of
maintaining the DMD within the temperature range specified
in the Recommended Operating Conditions. The
total heat load on the DMD is largely driven by the incident
light absorbed by the active area; although other
contributions include light energy absorbed by the window
aperture and electrical power dissipation of the array.
Optical systems must be designed to minimize the light
energy falling outside the window clear aperture since any
additional thermal load in this area can significantly
degrade the reliability of the device.
(2) The
thermal resistance values provided here assumes a
non-uniform illumination profile. Refer to Micromirror Array
Temperature Calculation for details.