JAJSGT9G April   2010  – January 2019 DLP5500

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーションの回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Window Characteristics
    12. 7.12 Chipset Component Usage Specification
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Video Modes
      2. 8.4.2 Structured Light Modes
        1. 8.4.2.1 Static Image Buffer Mode
        2. 8.4.2.2 Real Time Structured Light Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
    7. 8.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLP5500 System Interface
  10. 10Power Supply Recommendations
    1. 10.1 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デバイスの項目表記
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 関連資料
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • FYA|149
サーマルパッド・メカニカル・データ
発注情報

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
ELECTRICAL
VCC Voltage applied to VCC(2)(3) –0.5 4 V
VCCI Voltage applied to VCCI(2)(3) –0.5 4 V
Delta supply voltage |VCC – VCCI|(4) 0.3 V
|VID| Maximum differential voltage, Damage can occur to internal resistor if exceeded, See Figure 6 700 mV
VCC2 Voltage applied to VOFFSET(2)(3)(4) –0.5 8 V
VMBRST Voltage applied to MBRST[0:15] Input Pins –28 28 V
Voltage applied to all other pins(2) –0.5 VCC + 0.3 V
IOH Current required from a high-level output VOH = 2.4 V –20 mA
IOL Current required from a low-level output VOL = 0.4 V 15 mA
ENVIRONMENTAL
TCASE Case temperature: operational (5)(6) –20 90 ºC
Case temperature: non–operational (6) –40 90 ºC
Dew Point (Operating and non-Operating) 81 ºC
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to VSS (ground).
(3) Voltages VCC, VCCI, and VCC2 are required for proper DMD operation.
(4) Exceeding the recommended allowable absolute voltage difference between VCC and VCCI may result in excess current draw. The difference between VCC and VCCI, | VCC - VCCI|, should be less than .3V.
(5) Exposure of the DMD simultaneously to any combination of the maximum operating conditions for case temperature, differential temperature, or illumination power density (see Recommended Operating Conditions).
(6) DMD Temperature is the worst-case of any test point shown in Figure 16, or the active array as calculated by the Micromirror Array Temperature Calculation.