JAJSHY3 September   2019 DLP5534-Q1

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

1. 1 特長
2. 2 アプリケーション
3. 3 概要
   1.     Device Images
      1.      DLP5534-Q1 DLPチップセットのシステム・ブロック図
4. 4 改訂履歴
5. 5 Pin Configuration and Functions
   1.     Pin Functions – Connector Pins
   2.     Pin Functions – Test Pads
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  Switching Characteristics
   9. 6.9  System Mounting Interface Loads
   10. 6.10 Physical Characteristics of the Micromirror Array
   11. 6.11 Micromirror Array Optical Characteristics
   12. 6.12 Window Characteristics
   13. 6.13 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Sub-LVDS Data Interface
      2. 7.3.2 Low Speed Interface for Control
      3. 7.3.3 DMD Voltage Supplies
      4. 7.3.4 Asynchronous Reset
      5. 7.3.5 Temperature Sensing Diode
         1. 7.3.5.1 Temperature Sense Diode Theory
   4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
   5. 7.5 Micromirror Array Temperature Calculation
   6. 7.6 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Application Overview
      2. 8.2.2 Reference Design
      3. 8.2.3 Application Mission Profile Consideration
      4. 8.2.4 Illumination Mission Profile Considerations
9. 9 Power Supply Recommendations
   1. 9.1 Power Supply Power-Up Procedure
   2. 9.2 Power Supply Power-Down Procedure
   3. 9.3 Power Supply Sequencing Requirements
10. 10Layout
    1. 10.1 Layout Guidelines
11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
       1. 11.1.1 デバイスの項目表記
       2. 11.1.2 デバイスのマーキング
    2. 11.2 コミュニティ・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 DMD の取り扱い
    6. 11.6 Glossary
12. 12メカニカル、パッケージ、および注文情報