Over operating free-air temperature range (unless otherwise noted).(1) | MIN | MAX | UNIT |
---|
SUPPLY VOLTAGES |
VCC | Supply voltage for LVCMOS core logic(2) | –0.5 | 4 | V |
VCCI | Supply voltage for LVDS Interface(2) | –0.5 | 4 | V |
VOFFSET | Micromirror Electrode and HVCMOS voltage(2)(3) | –0.5 | 9 | V |
VMBRST | Input voltage for MBRST(15:0)(2) | –28 | 28 | V |
|VCCI – VCC| | Supply voltage delta (absolute value)(4) | | 0.3 | V |
INPUT VOLTAGES |
| Input voltage for all other input pins(2) | –0.5 | VCC + 0.3 | V |
|VID| | Input differential voltage (absolute value)(5) | | 700 | mV |
CLOCKS |
ƒCLOCK | Clock frequency for LVDS interface, DCLK_A | | 400 | MHz |
ƒCLOCK | Clock frequency for LVDS interface, DCLK_B | | 400 | MHz |
ENVIRONMENTAL |
TARRAY and TWINDOW | Temperature, operating(6) | 0 | 90 | °C |
Temperature, non–operating(6) | –40 | 90 | °C |
|TDELTA| | Absolute Temperature delta between any point on the window edge and the ceramic test point TP1(7) | | 30 | °C |
TDP | Dew point temperature, operating and non–operating (noncondensing) | | 81 | °C |
(1) Operation outside the Absolute Maximum Ratings may cause permanent device
damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any
other conditions beyond those listed under
Recommended Operating Conditions. If outside the
Recommended Operating Conditions but within the
Absolute Maximum Ratings, the device may not be
fully functional, and this may affect device
reliability, functionality, performance, and
shorten the device lifetime.
(2) All voltages are referenced to common ground VSS. VBIAS, VCC, VCCI, VOFFSET, and VRESET power supplies are all required for all DMD operating modes.
(3) VOFFSET supply transients must fall within specified voltages.
(4) Exceeding the recommended allowable voltage difference between VCC and VCCI may result in excessive current draw.
(5) The maximum LVDS input voltage rating applies when each input of a differential pair is at the same voltage potential.
(6) The highest temperature of the active array (as calculated using
Section 7.6) or of any point along the window edge as defined in
Figure 7-1. The locations of thermal test points TP2, TP3, TP4, and TP5 in
Figure 7-1 are intended to measure the highest window edge temperature. If a particular
application causes another point on the window edge to be at a higher
temperature, then that point should be used.
(7) Temperature delta is the highest difference between the ceramic test point 1
(TP1) and anywhere on the window edge as shown in
Figure 7-1. The window test points TP2, TP3, TP4, and TP5 shown in
Figure 7-1 are intended to result in the worst-case delta. If a particular application
causes another point on the window edge to result in a larger delta temperature,
then that point should be used.