JAJSLA9E may   2015  – april 2023 DLP7000UV

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. 概要 (続き)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  LVDS Timing Requirements
    8. 7.8  LVDS Waveform Requirements
    9. 7.9  Serial Control Bus Timing Requirements
    10. 7.10 Systems Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Window Characteristics
    14. 7.14 Chipset Component Usage Specification
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
      2. 8.3.2 DLPA200 DMD Micromirror Driver
      3. 8.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
      4. 8.3.4 DLP7000 - DLP 0.7 XGA 2xLVDS UV Type-A DMD
        1. 8.3.4.1 DLP7000UV Chipset Interfaces
          1. 8.3.4.1.1 DLPC410 Interface Description
            1. 8.3.4.1.1.1 DLPC410 IO
            2. 8.3.4.1.1.2 Initialization
            3. 8.3.4.1.1.3 DMD Device Detection
            4. 8.3.4.1.1.4 Power Down
        2. 8.3.4.2 DLPC410 to DMD Interface
          1. 8.3.4.2.1 DLPC410 to DMD IO Description
          2. 8.3.4.2.2 Data Flow
        3. 8.3.4.3 DLPC410 to DLPA200 Interface
          1. 8.3.4.3.1 DLPA200 Operation
          2. 8.3.4.3.2 DLPC410 to DLPA200 IO Description
        4. 8.3.4.4 DLPA200 to DLP7000UV Interface Overview
      5. 8.3.5 Measurement Conditions
    4. 8.4 Device Functional Modes
      1. 8.4.1 DMD Operation
        1. 8.4.1.1 Single Block Mode
        2. 8.4.1.2 Dual Block Mode
        3. 8.4.1.3 Quad Block Mode
        4. 8.4.1.4 Global Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation
    7. 8.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DMD Reflectivity Characteristics
      2. 9.1.2 Design Considerations Influencing DMD Reflectivity
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Sequence (Handled by the DLPC410)
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLP7000UV Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Device Marking
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Micromirror Array Temperature Calculation

Active array temperature cannot be measured directly; therefore, it must be computed analytically from measurement points on the outside of the package, package thermal resistance, electrical power, and illumination heat load. The relationship between array temperature and the reference ceramic temperature (test point number 1 in Figure 8-11) is provided by the following equations:

Equation 1. TArray = Measured Ceramic temperature at location (test point number 3) + (Temperature increase due to power incident to the array × array-to-ceramic resistance)
Equation 2. = TCeramic+ (QArray × RArray-To-Ceramic)

where

  • TCeramic = Measured ceramic temperature (°C) at location (test point number 3)
  • RArray-To-Ceramic = DMD package thermal resistance from array to outside ceramic (°C/W)
  • QArray = Total DMD array power, which is both electrical plus absorbed on the DMD active array (W)
  • QArray = QElectrical + (QIllumination × DMD absorption constant (0.42))

where

  • QElectrical = Approximate nominal electrical internal power dissipation (W)
  • QIllumination = [Illumination power density × illumination area on DMD] (W)
  • DMD absorption constant = 0.42

The electrical power dissipation of the DMD is variable and depends on the voltages, data rates and operating frequencies. The nominal electrical power dissipation of the DMD is variable and depends on the operating state of mirrors and the intensity of the light source. The DMD absorption constant of 0.42 assumes nominal operation with an illumination distribution of 83.7% on the active array, 11.9% on the array border, and 4.4% on the window aperture. A system aperture may be required to limit power incident on the package aperture since this area absorbs much more efficiently than the array.

Equation 3. Sample Calculation:
  • Illumination power density = 2 W/cm2
  • Illumination area = (1.4008 cm × 1.0506 cm) / 83.7% = 1.76 cm2 (assumes 83.7% on the active array and 16.3% overfill)
  • QIllumination= 2 W/cm2 × 1.76 cm2 = 3.52 W
  • QElectrical= 2.0 W
  • RArray-To-Ceramic = 0.9°C/W
  • TCeramic= 20°C (measured on ceramic)
  • QArray = 2.0 W + (3.52 W × 0.42) = 3.48 W
  • TArray = 20°C + (3.48 W × 0.9°C/W) =23.1°C