Thermal resistance, active area to test point 1 (TP1)(1)
0.50
°C/W
(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of maintaining the DMD within the temperature range specified in the Recommended Operating Conditions. The total heat load on the DMD is largely driven by the incident light absorbed by the active area, although other contributions include light energy absorbed by the window aperture and electrical power dissipation of the array. Minimizing the light energy falling outside the window clear aperture is a design requirement of the optical system because any additional thermal load in this area can significantly degrade the reliability of the device.