JAJSFX3F august   2012  – april 2023 DLP9500

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  LVDS Timing Requirements
    8. 6.8  LVDS Waveform Requirements
    9. 6.9  Serial Control Bus Timing Requirements
    10. 6.10 Systems Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Window Characteristics
    14. 6.14 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
      2. 7.3.2 DLPA200 - DMD Micromirror Drivers
      3. 7.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
      4. 7.3.4 DLP9500 - DLP 0.95 1080p 2xLVDS Type-A DMD 1080p DMD
        1. 7.3.4.1 DLP9500 1080p Chipset Interfaces
          1. 7.3.4.1.1 DLPC410 Interface Description
            1. 7.3.4.1.1.1 DLPC410 IO
            2. 7.3.4.1.1.2 Initialization
            3. 7.3.4.1.1.3 DMD Device Detection
            4. 7.3.4.1.1.4 Power Down
          2. 7.3.4.1.2 DLPC410 to DMD Interface
            1. 7.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 7.3.4.1.2.2 Data Flow
          3. 7.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 7.3.4.1.3.1 DLPA200 Operation
            2. 7.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 7.3.4.1.4 DLPA200 to DLP9500 Interface
            1. 7.3.4.1.4.1 DLPA200 to DLP9500 Interface Overview
      5. 7.3.5 Measurement Conditions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single Block Mode
      2. 7.4.2 Dual Block Mode
      3. 7.4.3 Quad Block Mode
      4. 7.4.4 Global Block Mode
    5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
      2. 7.5.2 Numerical Aperture and Stray Light Control
      3. 7.5.3 Pupil Match
      4. 7.5.4 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Thermal Test Points
      2. 7.6.2 Micromirror Array Temperature Calculation - Lumens Based
      3. 7.6.3 Micromirror Array Temperature Calculation - Power Density Based
      4. 7.6.4 59
    7. 7.7 Micromirror Landed-On and Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Device Description
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Sequence (Handled by the DLPC410)
    2. 9.2 DMD Power-Up and Power-Down Procedures
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
      4. 10.1.4 PCB Layout Guidelines
        1. 10.1.4.1 DMD Interface
          1. 10.1.4.1.1 Trace Length Matching
        2. 10.1.4.2 DLP9500 Decoupling
          1. 10.1.4.2.1 Decoupling Capacitors
        3. 10.1.4.3 VCC and VCC2
        4. 10.1.4.4 DMD Layout
        5. 10.1.4.5 DLPA200
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Marking
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.13 Window Characteristics

PARAMETER (1)TEST CONDITIONSMINTYPMAXUNIT
Window material designationCorning 7056
Window refractive indexAt wavelength 589 nm1.487
Window flatness(4)Per 25 mm4fringes
Window artifact sizeWithin the Window Aperture (5)400µm
Window apertureSee (2)
Illumination overfillRefer to Section 7.5.4
Window transmittance, single–pass through both surfaces and glass (3)At wavelength 405 nm. Applies to 0° and 24° AOI only.95%
Minimum within the wavelength range 420 nm to 680 nm. Applies to all angles 0° to 30° AOI.96%
Average over the wavelength range 420 nm to 680 nm. Applies to all angles 30° to 45° AOI.96%
(1) See Window Characteristics and Optics for more information.
(2) For details regarding the size and location of the window aperture, see the package mechanical characteristics listed in the Mechanical ICD in the Mechanical, Packaging, and Orderable Information section.
(3) See the TI application report DLPA031, Wavelength Transmittance Considerations for DLP DMD Window.
(4) At a wavelength of 632.8 nm.
(5) See the Mechanical Packaging and Orderable Information section at the end of this document for details regarding the size and location of the window aperture.