JAJSLB2D november   2014  – april 2023 DLP9500UV

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  LVDS Timing Requirements
    8. 7.8  LVDS Waveform Requirements
    9. 7.9  Serial Control Bus Timing Requirements
    10. 7.10 Systems Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Chipset Component Usage Specification
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
      2. 8.3.2 DLPA200 - DMD Micromirror Drivers
      3. 8.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
      4. 8.3.4 DLP9500 - DLP 0.95 1080p 2xLVDS UV Type-A DMD 1080p DMD
        1. 8.3.4.1 DLP9500UV 1080p Chipset Interfaces
          1. 8.3.4.1.1 DLPC410 Interface Description
            1. 8.3.4.1.1.1 DLPC410 IO
            2. 8.3.4.1.1.2 Initialization
            3. 8.3.4.1.1.3 DMD Device Detection
            4. 8.3.4.1.1.4 Power Down
          2. 8.3.4.1.2 DLPC410 to DMD Interface
            1. 8.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 8.3.4.1.2.2 Data Flow
          3. 8.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 8.3.4.1.3.1 DLPA200 Operation
            2. 8.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 8.3.4.1.4 DLPA200 to DLP9500UV Interface
            1. 8.3.4.1.4.1 DLPA200 to DLP9500UV Interface Overview
      5. 8.3.5 Measurement Conditions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single Block Mode
      2. 8.4.2 Dual Block Mode
      3. 8.4.3 Quad Block Mode
      4. 8.4.4 Global Block Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Thermal Test Points
      2. 8.6.2 Micromirror Array Temperature Calculation - Lumens Based
      3. 8.6.3 Micromirror Array Temperature Calculation - Power Density Based
      4. 8.6.4 59
    7. 8.7 Micromirror Landed-On and Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DMD Reflectivity Characteristics
        1. 9.1.1.1 Design Considerations Influencing DMD Reflectivity
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Device Description
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Sequence (Handled by the DLPC410)
    2. 10.2 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLP9500UV Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
      2. 12.1.2 Device Marking
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision C (February 2017) to Revision D (April 2023)

  • Changed Micromirror switching time typical value from 13 μs to 12.5 μs and removed 22 μs Max value. Go

Changes from Revision B (June 2015) to Revision C (February 2017)

  • Changed the name of Micromirror clocking pulse reset in Pin FunctionsGo
  • Changed TGRADIENT from 5°C to 10°C to accommodate increase in power density from 400 to 420 nm in Section 7.1 Go
  • Added RH name for relative humidity in Section 7.1 Go
  • Clarified TGRADIENT footnote in Section 7.1 Go
  • Changed Tstg to TDMD in Section 7.2 to conform to current nomenclatureGo
  • Changed typical micromirror crossover time to the time required to transition from mirror position to the other in Section 7.12 Go
  • Added typical micromirror switching time - 13 µs in Section 7.12 Go
  • Changed "Micromirror switching time" to "Array switching time" for clarity in Section 7.12 Go
  • Added clarification to Micromirror switching time at 400 MHz with global reset in Section 7.12 Go
  • Added "Digital Controller for Discovery 4100 chipset" to "DLPC410" headerGo
  • Changed "Flash Configuration PROM" heading to "DLPR410 PROM for DLP Discovery 4100 chipset" Go
  • Changed "DMD" heading to "DLP9500 - DLP 0.95 1080p 2xLVDS UV Type-A DMD 1080p DMDGo
  • Added DLPC410, DLPR410, DLP9500UV descriptions in Device Description section to match Feature Description sectioGo
  • Corrected number of banks of DMD mirrors to 15 in Section 9.2.1.1 Go
  • Removed link to DLP Discovery 4100 chipset datasheet in Section 12.2.1 Go
  • Added Section 12.3 tableGo

Changes from Revision A (June 2015) to Revision B (June 2015)

  • 完全なデータシートをリリースし、デバイスのステータスを量産データに更新。Go
  • チップセットの一覧の DLPR410 に DLPR4101 拡張 PROM を追加Go
  • 「製品情報」の本体サイズに 7.00mm の測定値を追加。 Go
  • Added environmental parameters to Section 7.1 Go
  • Moved VESD to Section 7.3 Go
  • Added new note to Section 7.5 Go
  • Replaced Figure 7-4 .Go
  • Changed units in Section 7.10 from lbs to N. Go
  • Added Section 7.13 Go
  • Corrected 6.33 W to 6.83 W in TArray sample calculation Go
  • Updated Figure 9-3 Go
  • Removed Thermal Considerations Go

Changes from Revision * (November 2014) to Revision A ()

  • リリースのためにデバイスのステータスを製品プレビューに更新Go
  • 最初のページの図を更新Go