DLPS082 February   2017 DLPA100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Storage Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Up Sequencing
      2. 7.3.2  Power Down Sequencing
      3. 7.3.3  Shutdown
        1. 7.3.3.1 Thermal
      4. 7.3.4  System Reset
      5. 7.3.5  Interrupt Logic
      6. 7.3.6  Serial Communications Port
      7. 7.3.7  Switching Regulators
        1. 7.3.7.1 Output Voltage - VOUT
        2. 7.3.7.2 Adjustable Linear Regulator - VLIN1
        3. 7.3.7.3 Adjustable Linear Regulator Control - VLIN2
      8. 7.3.8  Fan Controllers
      9. 7.3.9  Color Wheel Motor Driver
        1. 7.3.9.1 Color Wheel Motor Driver Power Dissipation
      10. 7.3.10 Color Wheel Switching Regulator Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Grounding Guidelines
      1. 10.2.1 Completely Isolated Ground Regions
      2. 10.2.2 Single Isolated Ground Region
      3. 10.2.3 Non-isolated Common Ground Region
    3. 10.3 Thermal Guidelines
    4. 10.4 Motor Control Guidelines
    5. 10.5 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DLP|48
サーマルパッド・メカニカル・データ

10.2 Grounding Guidelines

Ground pin 19 is isolated internally to the DLPA100 from pins 7 and 44. All three ground pins should be tied together on the PWB at the DLPA100 thermal pad connection. Depending on the application there are three grounding approaches for board layout:

  1. Completely isolated ground regions for the DLPA100 subcircuits.
  2. Single isolated ground region for the collective DLPA100 circuit.
  3. Non-isolated common ground region for the entire board.

The most favorable approach should be carefully considered for the specific application.