DLPS082 February   2017 DLPA100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Storage Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Up Sequencing
      2. 7.3.2  Power Down Sequencing
      3. 7.3.3  Shutdown
        1. 7.3.3.1 Thermal
      4. 7.3.4  System Reset
      5. 7.3.5  Interrupt Logic
      6. 7.3.6  Serial Communications Port
      7. 7.3.7  Switching Regulators
        1. 7.3.7.1 Output Voltage - VOUT
        2. 7.3.7.2 Adjustable Linear Regulator - VLIN1
        3. 7.3.7.3 Adjustable Linear Regulator Control - VLIN2
      8. 7.3.8  Fan Controllers
      9. 7.3.9  Color Wheel Motor Driver
        1. 7.3.9.1 Color Wheel Motor Driver Power Dissipation
      10. 7.3.10 Color Wheel Switching Regulator Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Grounding Guidelines
      1. 10.2.1 Completely Isolated Ground Regions
      2. 10.2.2 Single Isolated Ground Region
      3. 10.2.3 Non-isolated Common Ground Region
    3. 10.3 Thermal Guidelines
    4. 10.4 Motor Control Guidelines
    5. 10.5 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DLP|48
サーマルパッド・メカニカル・データ

10.2.3 Non-isolated Common Ground Region

In this case, the PWB has a solid non-isolated common ground layer for the entire board. In this configuration, use particular care during component placement and separate the noisy portions of the DLPA100 circuit from other sensitive signals on the board. The ground plane should connect to the DLPA100 with the array of thermal vias.