DLPS082 February   2017 DLPA100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Storage Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Up Sequencing
      2. 7.3.2  Power Down Sequencing
      3. 7.3.3  Shutdown
        1. 7.3.3.1 Thermal
      4. 7.3.4  System Reset
      5. 7.3.5  Interrupt Logic
      6. 7.3.6  Serial Communications Port
      7. 7.3.7  Switching Regulators
        1. 7.3.7.1 Output Voltage - VOUT
        2. 7.3.7.2 Adjustable Linear Regulator - VLIN1
        3. 7.3.7.3 Adjustable Linear Regulator Control - VLIN2
      8. 7.3.8  Fan Controllers
      9. 7.3.9  Color Wheel Motor Driver
        1. 7.3.9.1 Color Wheel Motor Driver Power Dissipation
      10. 7.3.10 Color Wheel Switching Regulator Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Grounding Guidelines
      1. 10.2.1 Completely Isolated Ground Regions
      2. 10.2.2 Single Isolated Ground Region
      3. 10.2.3 Non-isolated Common Ground Region
    3. 10.3 Thermal Guidelines
    4. 10.4 Motor Control Guidelines
    5. 10.5 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • DLP|48
サーマルパッド・メカニカル・データ

10.3 Thermal Guidelines

The PWB should have a thermal pad underneath the DLPA100 on both the top and bottom layers. The thermal pad on the top layer should extend to the edge of the terminal pads and include a 4x4 array of thermal vias. These thermal pads should connect to the internal ground planes via the thermal vias. It is recommended that the internal ground plane should extend for at least 20 square inches.

Careful consideration should be taken in providing an adequate amount of copper traces around the discrete Schottky diodes and MOSFET terminals used in the switching and linear converters to ensure proper thermal management. The thermal impedance (Tj-a) of each component should be calculated to determine the corresponding amount of copper required. If using an internal plane, it is important to use an array of thermal vias underneath the device tab or terminal to assist in the transfer of the heat.