JAJSGQ4G april   2010  – june 2023 DLPA200

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Configurations Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics Control Logic
    6. 7.6  5-V Linear Regulator
    7. 7.7  Bias Voltage Boost Converter
    8. 7.8  Reset Voltage Buck-Boost Converter
    9. 7.9  VOFFSET/DMDVCC2 Regulator
    10. 7.10 Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 5-V Linear Regulator
      2. 8.3.2 Bias Voltage Boost Converter
      3. 8.3.3 Reset Voltage Buck-Boost Converter
      4. 8.3.4 VOFFSET/DMDVCC2 Regulator
      5. 8.3.5 Serial Communications Port (SCP)
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Component Selection Guidelines
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Rail Guidelines
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Grounding Guidelines
    2. 11.2 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1)DLPA200UNIT
PFP (HTQFP)
80 PINS
Rc-jThermal resistance,
VBIAS = 26 V, VRESET = -26 V, VOFFSET = 10 V,
Output load = 390 pF and 39R on each output,
Phase by one with global mode,
Channel repetition frequency = 50 kHz,
Additional external loads: IBIAS = 5 mA,
IOFFSET = 30 mA, I5REG = 30 mA		3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report.