JAJSNS3A October   2015  – February 2023 DLPA3005

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Parameters
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Description
    3. 7.3 Feature Description
      1. 7.3.1 Supply and Monitoring
        1. 7.3.1.1 Supply
        2. 7.3.1.2 Monitoring
          1. 7.3.1.2.1 Block Faults
          2. 7.3.1.2.2 Auto LED Turn Off Functionality
          3. 7.3.1.2.3 Thermal Protection
      2. 7.3.2 Illumination
        1. 7.3.2.1 Programmable Gain Block
        2. 7.3.2.2 LDO Illumination
        3. 7.3.2.3 Illumination Driver A
        4. 7.3.2.4 RGB Strobe Decoder
          1. 7.3.2.4.1 Break Before Make (BBM)
          2. 7.3.2.4.2 Openloop Voltage
          3. 7.3.2.4.3 Transient Current Limit
        5. 7.3.2.5 Illumination Monitoring
          1. 7.3.2.5.1 Power Good
          2. 7.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 7.3.2.6 Illumination Driver plus Power FETs Efficiency
      3. 7.3.3 External Power FET Selection
        1. 7.3.3.1 Threshold Voltage
        2. 7.3.3.2 Gate Charge and Gate Timing
        3. 7.3.3.3 RDS(ON)
      4. 7.3.4 DMD Supplies
        1. 7.3.4.1 LDO DMD
        2. 7.3.4.2 DMD HV Regulator
        3. 7.3.4.3 DMD/DLPC Buck Converters
        4. 7.3.4.4 DMD Monitoring
          1. 7.3.4.4.1 Power Good
          2. 7.3.4.4.2 Overvoltage Fault
      5. 7.3.5 Buck Converters
        1. 7.3.5.1 LDO Bucks
        2. 7.3.5.2 General Purpose Buck Converter
        3. 7.3.5.3 Buck Converter Monitoring
          1. 7.3.5.3.1 Power Good
          2. 7.3.5.3.2 Overvoltage Fault
        4. 7.3.5.4 Buck Converter Efficiency
      6. 7.3.6 Auxiliary LDOs
      7. 7.3.7 Measurement System
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 SPI
      2. 7.5.2 Interrupt
      3. 7.5.3 Fast-Shutdown in Case of Fault
      4. 7.5.4 Protected Registers
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection for General-Purpose Buck Converters
      3. 8.2.3 Application Curve
    3. 8.3 System Example With DLPA3005 Internal Block Diagram
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up and Power-Down Timing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 SPI Connections
      2. 10.1.2 RLIM Routing
      3. 10.1.3 LED Connection
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 サード・パーティ製品に関する免責事項
    3. 11.3 Related Links
    4. 11.4 ドキュメントの更新通知を受け取る方法
    5. 11.5 サポート・リソース
    6. 11.6 Trademarks
    7. 11.7 静電気放電に関する注意事項
    8. 11.8 用語集
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)DLPA3005UNIT
PFD (HTQFP)
100 PINS
RθJAJunction-to-ambient thermal resistance(2)7.0°C/W
RθJC(top)Junction-to-case (top) thermal resistance(3)0.7°C/W
RθJBJunction-to-board thermal resistanceN/A°C/W
ψJTJunction-to-top characterization parameter(4)0.6°C/W
ψJBJunction-to-board characterization parameter(5)3.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, but since the device is intended to be cooled with a heatsink from the top case of the package, the simulation includes a fan and heatsink attached to the DLPA3005. The heatsink is a 22 mm × 22 mm × 12 mm aluminum pin fin heatsink with a 12 × 12 × 3 mm stud. Base thickness is 2 mm and pin diameter is 1.5 mm with an array of 6 × 6 pins. The heatsink is attached to the DLPA3005 with 100 um thick thermal grease with 3 W/m-K thermal conductivity. The fan is 20 × 20 × 8 mm with 1.6 cfm open volume flow rate and 0.22 in. water pressure at stagnation.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7), but modified to include the fan and heatsink described in note 2.
(5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7), but modified to include the fan and heatsink described in note 2.