JAJSF86F April   2010  – April 2018 DLPC200

PRODUCTION DATA.  

1. 1 特長
2. 2 アプリケーション
3. 3 概要
4. 4 改訂履歴
5. 5 Pin Configuration and Functions
   1.     Pin Functions
   2.     Power and Ground Pins
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Handling Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  I/O Electrical Characteristics
   6. 6.6  Video Input Pixel Interface Timing Requirements
   7. 6.7  I2C Interface Timing Requirements
   8. 6.8  USB Read Interface Timing Requirements
   9. 6.9  USB Write Interface Timing Requirements
   10. 6.10 SPI Slave Interface Timing Requirements
   11. 6.11 Parallel Flash Interface Timing Requirements
   12. 6.12 Serial Flash Interface Timing Requirements
   13. 6.13 Static RAM Interface Timing Requirements
   14. 6.14 DMD Interface Timing Requirements
   15. 6.15 DLPA200 Interface Timing Requirements
   16. 6.16 DDR2 SDR Memory Interface Timing Requirements
   17. 6.17 Video Input Pixel Interface – Image Sync and Blanking Requirements
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Frame Rates
   4. 7.4 Device Functional Modes
      1. 7.4.1 Video Modes
      2. 7.4.2 Structured Light Modes
         1. 7.4.2.1 Static Image Buffer Mode
         2. 7.4.2.2 Real Time Structured Light Mode
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 DLPC200 System Interfaces
            1. 8.2.2.1.1  DLPC200 Master, I2C Interface for EDID Programming
            2. 8.2.2.1.2  USB Interface
            3. 8.2.2.1.3  Bus Protocol
            4. 8.2.2.1.4  SPI Slave Interface
            5. 8.2.2.1.5  Parallel Flash Memory Interface
            6. 8.2.2.1.6  Serial Flash Memory Interface
            7. 8.2.2.1.7  SRAM Interface
            8. 8.2.2.1.8  DDR2 SDR Memory Interface
            9. 8.2.2.1.9  Projector Image and Control Port Signals
            10. 8.2.2.1.10 SDRAM Memory
      3. 8.2.3 Application Curve
9. 9 Power Supply Recommendations
   1. 9.1 Power-Up Requirements
   2. 9.2 Power-Down Requirements
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Impedance Requirements
       2. 10.1.2 PCB Signal Routing
       3. 10.1.3 Fiducials
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
       1. 10.3.1 Heat Sink
11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
       1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
       2. 11.1.2 デバイス・マーキング
    2. 11.2 ドキュメントのサポート
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
12. 12メカニカル、パッケージ、および注文情報