JAJSEK6D January   2017  – August 2021 DLPC3437

PRODUCTION DATA  

1. 1 特長
2. 2 アプリケーション
3. 3 概要
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Power Electrical Characteristics
   6. 6.6  Pin Electrical Characteristics
   7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
   8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
   9. 6.9  DMD Low-Speed Interface Electrical Characteristics
   10. 6.10 System Oscillators Timing Requirements
   11. 6.11 Power Supply and Reset Timing Requirements
   12. 6.12 Parallel Interface Frame Timing Requirements
   13. 6.13 Parallel Interface General Timing Requirements
   14. 6.14 Flash Interface Timing Requirements
   15. 6.15 Other Timing Requirements
   16. 6.16 DMD Sub-LVDS Interface Switching Characteristics
   17. 6.17 DMD Parking Switching Characteristics
   18. 6.18 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
         1. 7.3.1.1 Supported Resolution and Frame Rates
         2. 7.3.1.2 3D Display
         3. 7.3.1.3 Parallel Interface
            1. 7.3.1.3.1 Parallel Interface Data Transfer Format
      2. 7.3.2 Device Start-Up
      3. 7.3.3 SPI Flash
         1. 7.3.3.1 SPI Flash Interface
         2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
         1. 7.3.9.1 Sub-LVDS (HS) Interface
   4. 7.4 Device Functional Modes
   5. 7.5 Programming
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
9. 9 Power Supply Recommendations
   1. 9.1 PLL Design Considerations
   2. 9.2 System Power-Up and Power-Down Sequence
   3. 9.3 Power-Up Initialization Sequence
   4. 9.4 DMD Fast PARK Control (PARKZ)
   5. 9.5 Hot Plug I/O Usage
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 PLL Power Layout
       2. 10.1.2 Reference Clock Layout
          1. 10.1.2.1 Recommended Crystal Oscillator Configuration
       3. 10.1.3 Unused Pins
       4. 10.1.4 DMD Control and Sub-LVDS Signals
       5. 10.1.5 Layer Changes
       6. 10.1.6 Stubs
       7. 10.1.7 Terminations
       8. 10.1.8 Routing Vias
       9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
11. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 Third-Party Products Disclaimer
       2. 11.1.2 Device Nomenclature
          1. 11.1.2.1 Device Markings
          2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
       1. 12.1.1 Packaging Information