JAJSLD1C May 2021 – November 2022 DLPC6540
PRODUCTION DATA
PARAMETER | VALUE | UNITS |
---|---|---|
Number of balls (signal/thermal) | 612 / 64 | |
Ball pitch | 1.00 | mm |
UBM (under bump metallurgy) | 0.48 (See Figure 10-1) | mm |
BPD (ball pad diameter) | 0.58 (See Figure 10-1) | mm |
Body dimension | See Mechanical Drawing | mm |
Mold compound dimensions | See Mechanical Drawing | mm |
Package volume class | 350 - 2000 (J-STD-20D) | mm3 |
Approximate weight | 5.64 | g |
Substrate circuit | Pb-free | |
Package balls | Pb-free | |
Solder paste | Pb-free | |
Solder profile | TC =250°C, TP = 253°C (J-STD-20D) | |
Moisture sensitivity level | MSL Level 3 (J-STD-20D) | |
Solder ball composition | SAC305 | |
WIrebond | Cu | |
Mounting technique | a) Hot air reflow (including the combination of long and/or medium infrared ray reflow) b) Long or medium infrared ray reflow |