The following are recommendations for best
performance:
- Solid ground planes between each
signal routing layer
- Solid power planes for
voltages
- Connect power and ground pins to
these planes through a via for each pin.
- Minimize trace lengths for the
component power and ground pins to 0.100 inches or less.
- Space apart vias to avoid forming
slots in power planes.
- High-speed signals must not cross
over a slot in the adjacent (reference) power planes.
- Placing extra vias is not
required if there are sufficient ground vias due to normal ground connection
devices.