JAJSFL2H March   2016  – November 2019 DRA722 , DRA724 , DRA725 , DRA726

PRODUCTION DATA.  

  1. 1 デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2 改訂履歴
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Ports (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  Camera Serial Interface 2 CAL bridge (CSI2)
      5. 4.4.5  External Memory Interface (EMIF)
      6. 4.4.6  General-Purpose Memory Controller (GPMC)
      7. 4.4.7  Timers
      8. 4.4.8  Inter-Integrated Circuit Interface (I2C)
      9. 4.4.9  HDQ / 1-Wire Interface (HDQ1W)
      10. 4.4.10 Universal Asynchronous Receiver Transmitter (UART)
      11. 4.4.11 Multichannel Serial Peripheral Interface (McSPI)
      12. 4.4.12 Quad Serial Peripheral Interface (QSPI)
      13. 4.4.13 Multicannel Audio Serial Port (McASP)
      14. 4.4.14 Universal Serial Bus (USB)
      15. 4.4.15 SATA
      16. 4.4.16 Peripheral Component Interconnect Express (PCIe)
      17. 4.4.17 Controller Area Network Interface (DCAN)
      18. 4.4.18 Ethernet Interface (GMAC_SW)
      19. 4.4.19 Media Local Bus (MLB) Interface
      20. 4.4.20 eMMC/SD/SDIO
      21. 4.4.21 General-Purpose Interface (GPIO)
      22. 4.4.22 Keyboard controller (KBD)
      23. 4.4.23 Pulse Width Modulation (PWM) Interface
      24. 4.4.24 Audio Tracking Logic (ATL)
      25. 4.4.25 Test Interfaces
      26. 4.4.26 System and Miscellaneous
        1. 4.4.26.1 Sysboot
        2. 4.4.26.2 Power, Reset, and Clock Management (PRCM)
        3. 4.4.26.3 Real-Time Clock (RTC) Interface
        4. 4.4.26.4 System Direct Memory Access (SDMA)
        5. 4.4.26.5 Interrupt Controllers (INTC)
        6. 4.4.26.6 Observability
      27. 4.4.27 Power Supplies
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On-Hour (POH) Limits
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6  Power Consumption Summary
    7. 5.7  Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  LVCMOS CSI2 DC Electrical Characteristics
      8. 5.7.8  BMLB18 Buffers DC Electrical Characteristics
      9. 5.7.9  BC1833IHHV Buffers DC Electrical Characteristics
      10. 5.7.10 USBPHY DC Electrical Characteristics
      11. 5.7.11 Dual Voltage SDIO1833 DC Electrical Characteristics
      12. 5.7.12 Dual Voltage LVCMOS DC Electrical Characteristics
      13. 5.7.13 SATAPHY DC Electrical Characteristics
      14. 5.7.14 PCIEPHY DC Electrical Characteristics
    8. 5.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. Table 5-20 Recommended Operating Conditions for OTP eFuse Programming
      2. 5.8.1      Hardware Requirements
      3. 5.8.2      Programming Sequence
      4. 5.8.3      Impact to Your Hardware Warranty
    9. 5.9  Thermal Characteristics
      1. 5.9.1 Package Thermal Characteristics
    10. 5.10 Power Supply Sequences
  6. 6 Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
        3. 6.1.4.3 RC On-die Oscillator Clock
    2. 6.2 DPLLs, DLLs Specifications
      1. 6.2.1 DPLL Characteristics
      2. 6.2.2 DLL Characteristics
      3. 6.2.3 DPLL and DLL Noise Isolation
  7. 7 Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem - Video Output Ports
    8. 7.8  Display Subsystem - High-Definition Multimedia Interface (HDMI)
    9. 7.9  Camera Serial Interface 2 CAL bridge (CSI2)
      1. 7.9.1 CSI-2 MIPI D-PHY
    10. 7.10 External Memory Interface (EMIF)
    11. 7.11 General-Purpose Memory Controller (GPMC)
      1. 7.11.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.11.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.11.3 GPMC/NAND Flash Interface Asynchronous Timing
    12. 7.12 Timers
    13. 7.13 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-33 Timing Requirements for I2C Input Timings
      2. Table 7-34 Timing Requirements for I2C HS-Mode (I2C3/4/5/6 Only)
      3. Table 7-35 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    14. 7.14 HDQ / 1-Wire Interface (HDQ1W)
      1. 7.14.1 HDQ / 1-Wire - HDQ Mode
      2. 7.14.2 HDQ/1-Wire-1-Wire Mode
    15. 7.15 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-40 Timing Requirements for UART
      2. Table 7-41 Switching Characteristics Over Recommended Operating Conditions for UART
    16. 7.16 Multichannel Serial Peripheral Interface (McSPI)
    17. 7.17 Quad Serial Peripheral Interface (QSPI)
    18. 7.18 Multichannel Audio Serial Port (McASP)
      1. Table 7-48 Timing Requirements for McASP1
      2. Table 7-49 Timing Requirements for McASP2
      3. Table 7-50 Timing Requirements for McASP3/4/5/6/7/8
    19. 7.19 Universal Serial Bus (USB)
      1. 7.19.1 USB1 DRD PHY
      2. 7.19.2 USB2 PHY
      3. 7.19.3 USB3 DRD ULPI-SDR-Slave Mode-12-pin Mode
    20. 7.20 Serial Advanced Technology Attachment (SATA)
    21. 7.21 Peripheral Component Interconnect Express (PCIe)
    22. 7.22 Controller Area Network Interface (DCAN)
      1. Table 7-68 Timing Requirements for DCANx Receive
      2. Table 7-69 Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
    23. 7.23 Ethernet Interface (GMAC_SW)
      1. 7.23.1 GMAC MII Timings
        1. Table 7-70 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-71 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-72 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-73 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.23.2 GMAC MDIO Interface Timings
      3. 7.23.3 GMAC RMII Timings
        1. Table 7-78 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-79 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-80 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-81 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.23.4 GMAC RGMII Timings
        1. Table 7-85 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-86 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-87 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-88 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    24. 7.24 Media Local Bus (MLB) interface
    25. 7.25 eMMC/SD/SDIO
      1. 7.25.1 MMC1-SD Card Interface
        1. 7.25.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.25.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.25.1.3 SDR12, 4-bit data, half-cycle
        4. 7.25.1.4 SDR25, 4-bit data, half-cycle
        5. 7.25.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.25.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.25.1.7 UHS-I DDR50, 4-bit data
      2. 7.25.2 MMC2 - eMMC
        1. 7.25.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.25.2.2 High Speed JC64 SDR, 8-bit data, half cycle
        3. 7.25.2.3 High Speed HS200 JEDS84 SDR, 8-bit data, half cycle
        4. 7.25.2.4 High Speed JC64 DDR, 8-bit data
          1. Table 7-119 Switching Characteristics for MMC2 - JC64 High Speed DDR Mode
      3. 7.25.3 MMC3 and MMC4-SDIO/SD
        1. 7.25.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.25.3.2 MMC3 and MMC4, SD High Speed
        3. 7.25.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.25.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.25.3.5 MMC3 SDIO High Speed UHS-I SDR50 Mode, Half Cycle
    26. 7.26 General-Purpose Interface (GPIO)
    27. 7.27 Audio Tracking Logic (ATL)
      1. 7.27.1 ATL Electrical Data/Timing
        1. Table 7-141 Switching Characteristics Over Recommended Operating Conditions for ATL_CLKOUTx
    28. 7.28 System and Miscellaneous interfaces
    29. 7.29 Test Interfaces
      1. 7.29.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.29.1.1 JTAG Electrical Data/Timing
          1. Table 7-142 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-143 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-144 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-145 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.29.2 Trace Port Interface Unit (TPIU)
        1. 7.29.2.1 TPIU PLL DDR Mode
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Introduction
      1. 8.1.1 Initial Requirements and Guidelines
    2. 8.2 Power Optimizations
      1. 8.2.1 Step 1: PCB Stack-up
      2. 8.2.2 Step 2: Physical Placement
      3. 8.2.3 Step 3: Static Analysis
        1. 8.2.3.1 PDN Resistance and IR Drop
      4. 8.2.4 Step 4: Frequency Analysis
      5. 8.2.5 System ESD Generic Guidelines
        1. 8.2.5.1 System ESD Generic PCB Guideline
        2. 8.2.5.2 Miscellaneous EMC Guidelines to Mitigate ESD Immunity
        3. 8.2.5.3 ESD Protection System Design Consideration
      6. 8.2.6 EMI / EMC Issues Prevention
        1. 8.2.6.1 Signal Bandwidth
        2. 8.2.6.2 Signal Routing
          1. 8.2.6.2.1 Signal Routing—Sensitive Signals and Shielding
          2. 8.2.6.2.2 Signal Routing—Outer Layer Routing
        3. 8.2.6.3 Ground Guidelines
          1. 8.2.6.3.1 PCB Outer Layers
          2. 8.2.6.3.2 Metallic Frames
          3. 8.2.6.3.3 Connectors
          4. 8.2.6.3.4 Guard Ring on PCB Edges
          5. 8.2.6.3.5 Analog and Digital Ground
    3. 8.3 Core Power Domains
      1. 8.3.1 General Constraints and Theory
      2. 8.3.2 Voltage Decoupling
      3. 8.3.3 Static PDN Analysis
      4. 8.3.4 Dynamic PDN Analysis
      5. 8.3.5 Power Supply Mapping
      6. 8.3.6 DPLL Voltage Requirement
      7. 8.3.7 Loss of Input Power Event
      8. 8.3.8 Example PCB Design
        1. 8.3.8.1 Example Stack-up
        2. 8.3.8.2 vdd Example Analysis
    4. 8.4 Single-Ended Interfaces
      1. 8.4.1 General Routing Guidelines
      2. 8.4.2 QSPI Board Design and Layout Guidelines
    5. 8.5 Differential Interfaces
      1. 8.5.1 General Routing Guidelines
      2. 8.5.2 USB 2.0 Board Design and Layout Guidelines
        1. 8.5.2.1 Background
        2. 8.5.2.2 USB PHY Layout Guide
          1. 8.5.2.2.1 General Routing and Placement
          2. 8.5.2.2.2 Specific Guidelines for USB PHY Layout
            1. 8.5.2.2.2.1  Analog, PLL, and Digital Power Supply Filtering
            2. 8.5.2.2.2.2  Analog, Digital, and PLL Partitioning
            3. 8.5.2.2.2.3  Board Stackup
            4. 8.5.2.2.2.4  Cable Connector Socket
            5. 8.5.2.2.2.5  Clock Routings
            6. 8.5.2.2.2.6  Crystals/Oscillator
            7. 8.5.2.2.2.7  DP/DM Trace
            8. 8.5.2.2.2.8  DP/DM Vias
            9. 8.5.2.2.2.9  Image Planes
            10. 8.5.2.2.2.10 Power Regulators
        3. 8.5.2.3 References
      3. 8.5.3 USB 3.0 Board Design and Layout Guidelines
        1. 8.5.3.1 USB 3.0 interface introduction
        2. 8.5.3.2 USB 3.0 General routing rules
      4. 8.5.4 HDMI Board Design and Layout Guidelines
        1. 8.5.4.1 HDMI Interface Schematic
        2. 8.5.4.2 TMDS General Routing Guidelines
        3. 8.5.4.3 TPD5S115
        4. 8.5.4.4 HDMI ESD Protection Device (Required)
        5. 8.5.4.5 PCB Stackup Specifications
        6. 8.5.4.6 Grounding
      5. 8.5.5 SATA Board Design and Layout Guidelines
        1. 8.5.5.1 SATA Interface Schematic
        2. 8.5.5.2 Compatible SATA Components and Modes
        3. 8.5.5.3 PCB Stackup Specifications
        4. 8.5.5.4 Routing Specifications
      6. 8.5.6 PCIe Board Design and Layout Guidelines
        1. 8.5.6.1 PCIe Connections and Interface Compliance
          1. 8.5.6.1.1 Coupling Capacitors
          2. 8.5.6.1.2 Polarity Inversion
        2. 8.5.6.2 Non-standard PCIe connections
          1. 8.5.6.2.1 PCB Stackup Specifications
          2. 8.5.6.2.2 Routing Specifications
            1. 8.5.6.2.2.1 Impedance
            2. 8.5.6.2.2.2 Differential Coupling
            3. 8.5.6.2.2.3 Pair Length Matching
        3. 8.5.6.3 LJCB_REFN/P Connections
      7. 8.5.7 CSI2 Board Design and Routing Guidelines
        1. 8.5.7.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          1. 8.5.7.1.1 General Guidelines
          2. 8.5.7.1.2 Length Mismatch Guidelines
            1. 8.5.7.1.2.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          3. 8.5.7.1.3 Frequency-domain Specification Guidelines
    6. 8.6 Clock Routing Guidelines
      1. 8.6.1 32-kHz Oscillator Routing
      2. 8.6.2 Oscillator Ground Connection
    7. 8.7 DDR3 Board Design and Layout Guidelines
      1. 8.7.1 DDR3 General Board Layout Guidelines
      2. 8.7.2 DDR3 Board Design and Layout Guidelines
        1. 8.7.2.1  Board Designs
        2. 8.7.2.2  DDR3 EMIF
        3. 8.7.2.3  DDR3 Device Combinations
        4. 8.7.2.4  DDR3 Interface Schematic
          1. 8.7.2.4.1 32-Bit DDR3 Interface
          2. 8.7.2.4.2 16-Bit DDR3 Interface
        5. 8.7.2.5  Compatible JEDEC DDR3 Devices
        6. 8.7.2.6  PCB Stackup
        7. 8.7.2.7  Placement
        8. 8.7.2.8  DDR3 Keepout Region
        9. 8.7.2.9  Bulk Bypass Capacitors
        10. 8.7.2.10 High Speed Bypass Capacitors
          1. 8.7.2.10.1 Return Current Bypass Capacitors
        11. 8.7.2.11 Net Classes
        12. 8.7.2.12 DDR3 Signal Termination
        13. 8.7.2.13 VREF_DDR Routing
        14. 8.7.2.14 VTT
        15. 8.7.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.7.2.15.1 Four DDR3 Devices
            1. 8.7.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.7.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.7.2.15.2 Two DDR3 Devices
            1. 8.7.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.7.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.7.2.15.3 One DDR3 Device
            1. 8.7.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.7.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.7.2.16 Data Topologies and Routing Definition
          1. 8.7.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.7.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.7.2.17 Routing Specification
          1. 8.7.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.7.2.17.2 DQS and DQ Routing Specification
  9. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Related Links
    5. 9.5 Support Resources
    6. 9.6 商標
    7. 9.7 静電気放電に関する注意事項
    8. 9.8 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
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発注情報

4.4.27 Power Supplies

NOTE

For more information, see Power, Reset, and Clock Management chapter in the device TRM.

Table 4-35 Power Supply Signal Descriptions

SIGNAL NAME DESCRIPTION TYPE BALL
vdd Core voltage domain supply PWR H13 / H14 / J17 / J18 / L7 / L8 / N10 / N13 / P11 / P12 / P13 / R11 / R16 / R19 / T13 / T16 / T19 / U13 / U16 / U8 / U9 / V16 / V8
vpp(2) eFuse power supply PWR K14
vss Ground GND A1 / A14 / A2 / A23 / A28 / A6 / AA14 / AA15 / AA20 / AA8 / AA9 / AB14 / AB20 / AD1 / AD24 / AG1 / AH1 / AH2 / AH20 / AH28 / B1 / D13 / D19 / E13 / E19 / F1 / F7 / G7 / G8 / G9 / H12 / J12 / J15 / J28 / K1 / K15 / K24 / K25 / K4 / K5 / L13 / L14 / M19 / N14 / N15 / N19 / N24 / N25 / P28 / R1 / R12 / R13 / R21 / T10 / T11 / T12 / T14 / T15 / T17 / T18 / T21 / U14 / U15 / U17 / U20 / U21 / V15 / V17 / W1 / W15 / W24 / W25 / W28
cap_vbbldo_gpu(1) External capacitor connection for the GPU vbb ldo output CAP Y14
cap_vbbldo_iva(1) External capacitor connection for the IVA vbb ldo output CAP J10
cap_vbbldo_mpu(1) External capacitor connection for the MPU vbb ldo output CAP J16
cap_vbbldo_dsp(1) External capacitor connection for the DSP vbb ldo output CAP K9
cap_vddram_core1(1) External capacitor connection for the Core SRAM array ldo1 output CAP T20
cap_vddram_core3(1) External capacitor connection for the Core SRAM array ldo3 output CAP L9
cap_vddram_core4(1) External capacitor connection for the Core SRAM array ldo4 output CAP J19
cap_vddram_mpu(1) External capacitor connection for the MPU SRAM array ldo output CAP K19
cap_vddram_gpu(1) External capacitor connection for the GPU SRAM array ldo output CAP Y13
cap_vddram_iva(1) External capacitor connection for the IVA SRAM array ldo output CAP K16
cap_vddram_dsp(1) External capacitor connection for the DSP CAP J9
vdda_dsp_iva DSP PLL and IVA PLL analog power supply PWR N12
vdda_core_gmac DPLL_CORE and CORE HSDIVIDER analog power supply PWR P14
vdda_pll_spare DPLL_SPARE analog power supply PWR P15
vdda_per DPLL_ABE, DPLL_PER, and PER HSDIVIDER analog power supply PWR M14
vdda_mpu_abe MPU_ABE PLL analog power supply PWR N16
vdda33v_usb1 HS USB1 3.3V analog power supply. If USB1 is not used, this pin can alternatively be connected to VSS if the following requirements are met:
- The usb1_dm/usb1_dp pins are left unconnected
- The USB1 PHY is kept powered down		 PWR AA12
vdda33v_usb2 HS USB2 3.3V analog power supply. If USB2 is not used, this pin can alternatively be connected to VSS if the following requirements are met:
- The usb2_dm/usb2_dp pins are left unconnected
- The USB2 PHY is kept powered down		 PWR Y12
vdda_ddr DPLL_DDR and DDR HSDIVIDER analog power supply PWR R17
vdda_debug DPLL_DEBUG analog power supply PWR N11
vdda_gpu DPLL_GPU analog power supply PWR R14
vdda_hdmi PLL_HDMI and HDMI analog power supply PWR Y17
vdda_osc HFOSC analog power supply PWR AD16 / AE16
vdda_pcie DPLL_PCIe_REF and PCIe analog power supply PWR AA17
vdda_pcie0 PCIe ch0 RX/TX analog power supply PWR AA16
vdda_rtc RTC bias and RTC LFOSC analog power supply PWR AB13
vdda_sata DPLL_SATA and SATA RX/TX analog power supply PWR V13
vdda_usb1 DPLL_USB and HS USB1 1.8V analog power supply PWR AA13
vdda_usb2 HS USB2 1.8V analog power supply PWR AB12
vdda_usb3 DPLL_USB_OTG_SS and USB3.0 RX/TX analog power supply PWR W14
vdda_csi CSI Interface 1.8v Supply PWR W12
vdda_video VIDEO1 and VIDEO2 PLL analog power supply PWR P16
vdds18v 1.8V power supply PWR G18 / H17 / M8 / M9 / N8 / P8 / R8 / T8 / V21 / V22 / W17 / W18
vdds18v_ddr1 EMIF1 bias power supply PWR AA18 / AA19 / N21 / P20 / P21 / W21 / Y21
vddshv1 Dual Voltage (1.8V or 3.3V) power supply for the VIN2 Power Group pins PWR E3 / E5 / G4 / G5 / H8 / H9
vddshv2 Dual Voltage (1.8V or 3.3V) power supply for the VOUT Power Group pins PWR B6 / D10 / E10 / H10 / H11
vddshv3 Dual Voltage (1.8V or 3.3V) power supply for the GENERAL Power Group pins PWR B23 / D16 / D22 / E16 / E22 / G15 / H15 / H16 / H18 / H19
vddshv4 Dual Voltage (1.8V or 3.3V) power supply for the MMC4 Power Group pins PWR C24
vddshv5 Dual Voltage (1.8V or 3.3V) power supply for the RTC Power Group pins PWR V12
vddshv6 Dual Voltage (1.8V or 3.3V) power supply for the VIN1 Power Group pins PWR AD5 / AD7 / AE7 / AF5
vddshv7 Dual Voltage (1.8V or 3.3V) power supply for the WIFI Power Group pins PWR AB6 / AB7
vddshv8 Dual Voltage (1.8V or 3.3V) power supply for the MMC1 Power Group pins PWR W8 / Y8
vddshv9 Dual Voltage (1.8V or 3.3V) power supply for the RGMII Power Group pins PWR U10 / W4 / W5
vddshv10 Dual Voltage (1.8V or 3.3V) power supply for the GPMC Power Group pins PWR N4 / N5 / P10 / R10 / R7 / T4 / T5
vddshv11 Dual Voltage (1.8V or 3.3V) power supply for the MMC2 Power Group pins PWR J8 / K8
vdds_ddr1 EMIF1 power supply (1.5V for DDR3 mode / 1.35V DDR3L mode) PWR AA21 / AA22 / AB21 / AB22 / AB24 / AB25 / AC22 / AD26 / AG20 / AG28 / AH27 / T24 / T25 / W16 / W27
vdds_mlbp MLBP IO power supply PWR AA7 / Y7
vdd_dsp DSP voltage domain supply PWR K10 / K11 / L10 / L11 / M10 / M11
vdd_gpu GPU voltage domain supply PWR U11 / U12 / V10 / V11 / V14 / W10 / W11 / W13
vdd_iva IVA voltage domain supply PWR J13 / K12 / K13 / L12 / M12 / M13
vdd_mpu MPU voltage domain supply PWR K17 / K18 / L15 / L16 / L17 / L18 / L19 / M15 / M16 / M17 / M18 / N17 / N18 / P17 / P18 / R18
vdd_rtc RTC voltage domain supply PWR AB15
vssa_hdmi DPLL_HDMI and HDMI PHY analog ground GND AD19 / AE19
vssa_osc0 OSC0 analog ground GND AF15
vssa_osc1 OSC1 analog ground GND AC14
vssa_pcie PCIe analog ground GND AD13 / AE13
vssa_sata SATA analog ground GND AE10
vssa_usb HS USB1 and HS USB2 analog ground GND AA11 / AB11
vssa_usb3 DPLL_USB and USB3.0 RX/TX analog ground GND AD10
vssa_csi CSI Interface 0v Supply GND AA10 / AH8
vssa_video DPLL_VIDEO1 analog ground GND R15
  1. This pin must always be connected via a 1-µF capacitor to vss.
  2. This signal is valid only for High-Security devices. For more details, see Section 5.8VPP Specification for One-Time Programmable (OTP) eFUSEs. For General Purpose devices do not connect any signal, test point, or board trace to this signal.