JAJSEC0E January   2018  – March 2021 DRV10974

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Speed Input and Control
      2. 7.3.2 Motor Direction Change
      3. 7.3.3 Motor-Frequency Feedback (FG)
      4. 7.3.4 Lock Detection
        1. 7.3.4.1 Lock Kt Measure
        2. 7.3.4.2 Lock No Motor
        3. 7.3.4.3 Lock Open Loop Abnormal
        4. 7.3.4.4 Lock BEMF Abnormal
        5. 7.3.4.5 Lock Closed Loop Abnormal
        6. 7.3.4.6 Lock Speed Abnormal
      5. 7.3.5 Soft Current-Limit
      6. 7.3.6 Short-Circuit Current Protection
      7. 7.3.7 Overtemperature Protection
      8. 7.3.8 Undervoltage Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Spin-Up Settings
        1. 7.4.1.1 Motor Start
        2. 7.4.1.2 Initial Speed Detect
        3. 7.4.1.3 Align
      2. 7.4.2 Open-Loop Acceleration
      3. 7.4.3 Start-Up Current Sensing
      4. 7.4.4 Closed Loop
      5. 7.4.5 Control Advance Angle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

GUID-96D0A904-0154-4079-BA2B-BF115A9A3305-low.svg
NC – No internal connection
Figure 5-1 PWP PowerPAD™ Package16-Pin HTSSOP With Exposed Thermal PadTop View
GUID-4077D25C-B9DF-4AE1-99D4-0FA7C35207B4-low.svg
NC – No internal connection
Figure 5-2 RUM Package16-Pin WQFN With Exposed Thermal PadTop View
Table 5-1 Pin Functions
PIN I/O TYPE(1) DESCRIPTION
NAME. NO.
HTSSOP WQFN
ADV 1 15 I D Selects the applied lead angle by 1/8-W resistor; not to be driven externally with a source; leaving the pin open results in the longest lead angle; the lead angle is determined by the ADV pin voltage at power up.
CS 8 6 I D Selects current limit by 1/8-W resistor; not to be driven externally with a source; leaving the pin open results in the highest current limit; the current limit is determined by the CS pin voltage at power up.
FG 3 1 O D Provides motor speed feedback; open-drain output with internal pullup to V3P3; needs a pullup resistor to limit current if pullup voltage is higher than V3P3
FR 2 16 I D Direction control. FR = 0: U→V→W; FR = 1: U→W→V; value is determined by the FR pin state on exit of low-power mode; internal pulldown
GND 7, 16 5, 14 — — Digital and analog ground
NC 9 8 — NC No internal connection
PGND 10 7 — P Power ground connection for motor power
PWM 4 2 I D Motor speed-control input; auto detect for analog or digital mode; internal pullup to 2.2 V
RMP 6 4 I D Acceleration ramp-rate control; 1/8-W resistor to GND to set acceleration rate; leaving the pin open results in the slowest acceleration rate; the acceleration rate is determined by the RMP pin voltage at power up.
U 11 9 I/O A Motor phase U
V 12 10 I/O A Motor phase V
V1P8 5 3 O P LDO regulator for internal operation; 1-µF, 6.3-V ceramic capacitor tied to GND. Can supply a maximum of 3 mA to an extenal load.
VCC 14 12 I P Power-supply connection; 10-µF, 25-V ceramic capacitor tied to GND
VCP 15 13 O A Charge-pump output; 100-nF, 10-V ceramic capacitor tied to VCC
W 13 11 I/O A Motor phase W
Thermal pad — — — — The exposed thermal pad must be electrically connected to the ground plane by soldering to the PCB for proper operation, and connected to the bottom side of the PCB through vias for better thermal spreading.
(1) I = Input, O = Output, I/O = Input/output, P = Power, D = Digital, A = Analog, NC = No connection