JAJSMZ5B September 2021 – February 2022 DRV8311
PRODUCTION DATA
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
POWER SUPPLIES | ||||||
IVMQ | VM sleep mode current | VVM = 12 V, nSLEEP = 0, TA = 25 °C | 1.5 | 3 | µA | |
nSLEEP = 0, TA = 125 °C | 9 | µA | ||||
IVMS | VM standby mode current | VVM = 12 V, nSLEEP = 1, INHx = INLx = 0, SPI = 'OFF', TA = 25 °C | 7 | 12 | mA | |
nSLEEP = 1, INHx = INLx = 0, SPI = 'OFF' | 8 | 12 | mA | |||
IVM | VM operating mode current | VVM = 12 V, nSLEEP = 1, fPWM = 25 kHz, TA = 25 °C | 10 | 13 | mA | |
VVM = 12 V, nSLEEP = 1, fPWM = 200 kHz, TA = 25 °C | 12 | 14 | mA | |||
nSLEEP =1, fPWM = 25 kHz | 10 | 15 | mA | |||
nSLEEP =1, fPWM = 200 kHz | 12 | 15 | mA | |||
VAVDD | Analog regulator voltage | VVM > 4V, VVIN_AVDD > 4.5V, 0 mA ≤ IAVDD ≤ 100 mA | 3.15 | 3.3 | 3.45 | V |
VAVDD | VVM > 3.5V, 3.5V ≤VVIN_AVDD ≤ 4.5V, 0 mA ≤ IAVDD ≤ 35 mA | 3 | 3.3 | 3.6 | V | |
VAVDD | 2.5V ≤VVIN_AVDD ≤ 3.5V, 0 mA ≤ IAVDD ≤ 10 mA | 2.2 | VIN_AVDD-0.3 | 3.4 | V | |
VAVDD | VVM < 4V, VVIN_AVDD > 4.5V, 0 mA ≤ IAVDD ≤ 40 mA | 3 | 3.3 | 3.6 | V | |
VAVDD | VVM < 3.5V, 3.5V ≤VVIN_AVDD ≤ 4.5V, 0 mA ≤ IAVDD ≤ 20 mA | 3 | 3.3 | 3.6 | V | |
IAVDD_LIM | External analog regulator current limit | 148 | 200 | 250 | mA | |
IAVDD | External analog regulator load | VVM > 4V, VVIN_AVDD > 4.5V | 100 | mA | ||
VVM < 4V, VVIN_AVDD > 4.5V | 40 | mA | ||||
VVM > 3.5V, 3.6V ≤VVIN_AVDD ≤ 4.5V | 35 | mA | ||||
VVM < 3.5V, 3.6V ≤VVIN_AVDD ≤ 4.5V | 20 | mA | ||||
2.5V ≤VVIN_AVDD ≤ 3.6V | 10 | mA | ||||
CAVDD | Capacitance on AVDD pin | IAVDD ≤ 25 mA; | 0.7 | 1 | 7 | µF |
IAVDD ≥ 25 mA; | 3.3 | 4.7 | 7 | µF | ||
RAVDD | AVDD Output Voltage Regulation | VVIN_AVDD > 4.5V; IAVDD ≤ 20 mA; | -3 | 3 | % | |
VVIN_AVDD > 4.5V; 20 mA ≤ IAVDD ≤ 40 mA; | -2 | 2 | % | |||
VVIN_AVDD > 4.5V; IAVDD ≥ 40 mA; | -3 | 3 | % | |||
VVCP | Charge pump regulator voltage | VCP with respect to VM | 3 | 5 | 5.6 | V |
tWAKE | Wakeup time | VVM > VUVLO, nSLEEP = 1 to Output ready | 1 | 3 | ms | |
tWAKE_CSA | Wakeup time for CSA | VCSAREF > VCSAREF_UV to SOx ready, when nSLEEP = 1 | 30 | 50 | µs | |
tSLEEP | Turn-off time | nSLEEP = 0 to driver tri-stated | 100 | 200 | µs | |
tRST | Reset Pulse time | nSLEEP = 0 period to reset faults | 10 | 65 | µs | |
LOGIC-LEVEL INPUTS (INHx, INLx, nSLEEP, SCLK, SDI) | ||||||
VIL | Input logic low voltage | 0 | 0.6 | V | ||
VIH | Input logic high voltage | 1.65 | 5.5 | V | ||
VHYS | Input logic hysteresis | 100 | 300 | 660 | mV | |
IIL | Input logic low current | VPIN (Pin Voltage) = 0 V | –1 | 1 | µA | |
IIH | Input logic high current | nSLEEP, VPIN (Pin Voltage) = 5 V | 30 | µA | ||
Other pins, VPIN (Pin Voltage) = 5 V | 50 | µA | ||||
RPD | Input pulldown resistance | nSLEEP | 230 | 300 | kΩ | |
Other pins | 160 | 200 | kΩ | |||
CID | Input capacitance | 30 | pF | |||
LOGIC-LEVEL INPUTS (nSCS) | ||||||
VIL | Input logic low voltage | 0 | 0.6 | V | ||
VIH | Input logic high voltage | 1.5 | 5.5 | V | ||
VHYS | Input logic hysteresis | 200 | 500 | mV | ||
IIL | Input logic low current | VPIN (Pin Voltage) = 0 V | 90 | µA | ||
IIH | Input logic high current | VPIN (Pin Voltage) = 5 V | 70 | µA | ||
RPU | Input pullup resistance | 48 | 90 | kΩ | ||
CID | Input capacitance | 30 | pF | |||
FOUR-LEVEL INPUTS (GAIN, MODE, SLEW) | ||||||
VL1 | Input mode 1 voltage | Tied to AGND | 0 | 0.21*AVDD | V | |
VL2 | Input mode 2 voltage | 47 kΩ +/- 5% tied to GND | 0.25*AVDD | 0.5*AVDD | 0.55*AVDD | V |
VL3 | Input mode 3 voltage | Hi-Z | 0.606*AVDD | 0.757*AVDD | 0.909*AVDD | V |
VL4 | Input mode 4 voltage | Tied to AVDD | 0.94*AVDD | AVDD | V | |
RPU | Input pullup resistance | To AVDD | 48 | 70 | kΩ | |
RPD | Input pulldown resistance | To AGND | 160 | 200 | kΩ | |
OPEN-DRAIN OUTPUTS (nFAULT) | ||||||
VOL | Output logic low voltage | IOD = -5 mA | 0.4 | V | ||
IOH | Output logic high current | VOD = 5 V | –1 | 1 | µA | |
COD | Output capacitance | 30 | pF | |||
PUSH-PULL OUTPUTS (SDO) | ||||||
VOL | Output logic low voltage | IOP = -5 mA, 2.2V ≤ VAVDD ≤ 3V | 0 | 0.55 | V | |
IOP = -5 mA, 3V ≤ VAVDD ≤ 3.6V | 0 | 0.5 | V | |||
VOH | Output logic high voltage | IOP = 5 mA, 2.2V ≤ VAVDD ≤ 3V | VAVDD - 0.86 | 3 | V | |
IOP = 5 mA, 3V ≤ VAVDD ≤ 3.6V | VAVDD - 0.5 | 3.6 | V | |||
IOL | Output logic low current | VOP = 0 V | –1 | 1 | µA | |
IOH | Output logic high current | VOP = 5 V | –1 | 1 | µA | |
COD | Output capacitance | 30 | pF | |||
DRIVER OUTPUTS | ||||||
RDS(ON) | Total MOSFET on resistance (High-side + Low-side) | 6V ≥ VVM ≥ 3 V, IOUT = 1 A, TJ = 25°C | 300 | 350 | mΩ | |
6V ≥ VVM ≥ 3 V, IOUT = 1 A, TJ = 150°C | 450 | 500 | mΩ | |||
VVM ≥ 6 V, IOUT = 1 A, TJ = 25°C | 210 | 250 | mΩ | |||
VVM ≥ 6 V, IOUT = 1 A, TJ = 150°C | 330 | 375 | mΩ | |||
SR | Phase pin slew rate switching low to high (Rising from 20 % to 80 % of VM) | VVM = 12V; SLEW = 00b (SPI Variant) or SLEW pin tied to AGND (HW Variant) | 18 | 35 | 55 | V/us |
SR | VVM = 12V; SLEW = 01b (SPI Variant) or SLEW pin to 47 kΩ +/- 5% tied to AGND (HW Variant) | 35 | 75 | 100 | V/us | |
SR | VVM = 12V; SLEW = 10b (SPI Variant) or SLEW pin to Hi-Z (HW Variant) | 90 | 180 | 225 | V/us | |
SR | VVM = 12V; SLEW = 11b (SPI Variant) or SLEW pin tied to AVDD (HW Variant) | 140 | 230 | 355 | Vus | |
SR | Phase pin slew rate switching high to low (Falling from 80 % to 20 % of VM) |
VVM = 12V; SLEW = 00b (SPI Variant) or SLEW pin tied to AGND (HW Variant) | 20 | 35 | 50 | V/us |
VVM = 12V; SLEW = 01b (SPI Variant) or SLEW pin to 47 kΩ +/- 5% tied to AGND (HW Variant) | 35 | 75 | 100 | V/us | ||
VVM = 12V; SLEW = 10b (SPI Variant) or SLEW pin to Hi-Z (HW Variant) | 80 | 180 | 225 | V/us | ||
VVM = 12V; SLEW = 11b (SPI Variant) or SLEW pin tied to AVDD (HW Variant) | 125 | 270 | 350 | V/us | ||
tDEAD | Output dead time (high to low / low to high) | VVM = 12V, SLEW = 00b (SPI Variant) or SLEW pin tied to AGND (HW Variant), DEADTIME = 000b, Handshake only | 500 | 1200 | ns | |
VVM = 12V, SLEW = 01b (SPI Variant) or SLEW pin to 47 kΩ +/- 5% tied to AGND (HW Variant), DEADTIME = 000b, Handshake only | 450 | 760 | ns | |||
VVM = 12V, SLEW = 10b (SPI Variant) or SLEW pin to Hi-Z (HW Variant), DEADTIME = 000b, Handshake only | 425 | 720 | ns | |||
VVM = 12V, SLEW = 11b (SPI Variant) or SLEW pin tied to AVDD (HW Variant), DEADTIME = 000b; Handshake only | 425 | 710 | ns | |||
VVM = 12 V, DEADTIME = 001b | 200 | 540 | ns | |||
VVM = 12 V, DEADTIME = 010b | 400 | 550 | ns | |||
VVM = 12 V, DEADTIME = 011b | 600 | 760 | ns | |||
VVM = 12 V, DEADTIME = 100b | 800 | 900 | ns | |||
VVM = 12 V, DEADTIME = 101b | 1000 | 1100 | ns | |||
VVM = 12 V, DEADTIME = 110b | 1200 | 1300 | ns | |||
VVM = 12 V, DEADTIME = 111b | 1400 | 1500 | ns | |||
tPD | Propagation delay (high-side / low-side ON/OFF) | INHx = 1 to OUTx transisition, VVM = 12V, SLEW = 00b (SPI Variant) or SLEW pin tied to AGND (HW Variant) | 1000 | 1500 | ns | |
INHx = 1 to OUTx transisition, VVM = 12V, SLEW = 01b (SPI Variant) or SLEW pin to 47 kΩ +/- 5% tied to AGND (HW Variant) | 650 | 1100 | ns | |||
INHx = 1 to OUTx transisition, VVM = 12V, SLEW = 10b (SPI Variant) or SLEW pin to Hi-Z (HW Variant) | 550 | 950 | ns | |||
INHx = 1 to OUTx transisition, VVM = 12V, SLEW = 11b (SPI Variant) or SLEW pin tied to AVDD (HW Variant) | 500 | 910 | ns | |||
tMIN_PULSE | Minimum output pulse width | SLEW = 11b | 500 | ns | ||
CURRENT SENSE AMPLIFIER | ||||||
GCSA | Current sense gain (SPI Device) | CSA_GAIN = 00 (SPI Variant) or GAIN pin tied to AGND (HW Variant) | 0.25 | V/A | ||
CSA_GAIN = 01 (SPI Variant) or GAIN pin to 47 kΩ +/- 5% tied to GND (HW Variant) | 0.5 | V/A | ||||
CSA_GAIN = 10 (SPI Variant) or GAIN pin to Hi-Z (HW Variant) | 1 | V/A | ||||
CSA_GAIN = 11 (SPI Variant) or GAIN pin tied to AVDD (HW Variant) | 2 | V/A | ||||
GCSA_ERR | Current sense gain error | TJ = 25°C, IPHASE < 2.5 A | –4 | 4 | % | |
TJ = 25°C, IPHASE > 2.5 A | –5 | 5 | % | |||
IPHASE < 2.5 A | –5.5 | 5.5 | % | |||
IPHASE > 2.5 A | –7 | 7 | % | |||
IMATCH | Current sense gain error matching between phases A, B and C | TJ = 25°C | –5 | 5 | % | |
–5 | 5 | % | ||||
FSPOS | Full scale positive current measurement | 5 | A | |||
FSNEG | Full scale negative current measurement | –5 | A | |||
VLINEAR | SOX output voltage linear range | 0.25 | VCSAREF – 0.25 | V | ||
IOFFSET_RT | Current sense offset low side current in (Room Temperature) | TJ = 25°C, Phase current = 0 A, GCSA = 0.25 V/A | –50 | 50 | mA | |
TJ = 25°C, Phase current = 0 A, GCSA = 0.5 V/A | –50 | 50 | mA | |||
TJ = 25°C, Phase current = 0 A, GCSA = 1 V/A | –30 | 30 | mA | |||
TJ = 25°C, Phase current = 0 A, GCSA = 2 V/A | –30 | 30 | mA | |||
IOFFSET | Current sense offset referred to low side current in | Phase current = 0 A, GCSA = 0.25 V/A | –70 | 70 | mA | |
Phase current = 0 A, GCSA = 0.5 V/A | –50 | 50 | mA | |||
Phase current = 0 A, GCSA = 1 V/A | –50 | 50 | mA | |||
Phase current = 0 A, GCSA = 2 V/A | –50 | 50 | mA | |||
tSET | Settling time to ±1%, 30 pF on SOx pin | Step on SOx = 1.2 V, GCSA = 0.25 V/A | 1 | μs | ||
Step on SOx = 1.2 V, GCSA = 0.5 V/A | 1 | μs | ||||
Step on SOx = 1.2 V, GCSA = 1 V/A | 1 | μs | ||||
Step on SOx = 1.2 V, GCSA = 2 V/A | 1 | μs | ||||
VDRIFT | Drift offset | Phase current = 0 A | –150 | 150 | µA/℃ | |
ICSAREF | CSAREF input current | CSAREF = 3.0 V | 1.7 | 3 | mA | |
PROTECTION CIRCUITS | ||||||
VUVLO | Supply undervoltage lockout (UVLO) | VM rising | 2.6 | 2.7 | 2.8 | V |
VM falling | 2.5 | 2.6 | 2.7 | V | ||
VUVLO_HYS | Supply undervoltage lockout hysteresis | Rising to falling threshold | 60 | 125 | 210 | mV |
tUVLO | Supply undervoltage deglitch time | 5 | 7.5 | 13 | µs | |
VVINAVDD_UV | AVDD supply input undervoltage lockout (VINAVDD_UV) | VIN_AVDD rising | 2.6 | 2.7 | 2.8 | V |
VIN_AVDD falling | 2.5 | 2.6 | 2.7 | V | ||
VVINAVDD_UV_HYS | AVDD supply input undervoltage lockout hysteresis | Rising to falling threshold | 100 | 125 | 150 | mV |
tVINAVDD_UV | AVDD supply input undervoltage deglitch time | 2.5 | 4 | 5 | µs | |
VCPUV | Charge pump undervoltage lockout (voltage with respect to VM) | VCP rising | 2 | 2.3 | 2.5 | V |
VCP falling | 2 | 2.2 | 2.4 | V | ||
VCPUV_HYS | Charge pump undervoltage lockout hysteresis | Rising to falling threshold | 65 | 100 | 125 | mV |
tCPUV | Charge pump undervoltage lockout deglitch time | 0.2 | 0.5 | µs | ||
VCSAREF_UV | CSA reference undervoltage lockout | VCSAREF rising | 1.68 | 1.8 | 1.95 | V |
VCSAREF_UV | CSA reference undervoltage lockout | VCSAREF falling | 1.6 | 1.7 | 1.85 | V |
VCSAREF_UV_HYS | CSA reference undervoltage lockout hysteresis | Rising to falling threshold | 70 | 90 | 110 | mV |
VAVDD_UV | Analog regulator undervoltage lockout | VAVDD rising | 1.8 | 2 | 2.2 | V |
VAVDD falling | 1.7 | 1.8 | 1.95 | V | ||
IOCP | Overcurrent protection trip point | OCP_LVL = 0 (SPI Variant) or MODE pin tied to AGND or MODE pin to Hi-Z (HW Variant) | 5.8 | 9 | 11.5 | A |
OCP_LVL = 1 (SPI Variant) or MODE pin tied to AVDD or MODE pin 47 kΩ +/- 5% tied to AGND (HW Variant) | 3.4 | 5 | 7.5 | A | ||
tBLANK | Overcurrent protection blanking time (SPI Variant) | OCP_TBLANK = 00b | 0.2 | µs | ||
OCP_TBLANK = 01b | 0.5 | µs | ||||
OCP_TBLANK = 10b | 0.8 | µs | ||||
OCP_TBLANK = 10b | 1 | µs | ||||
tBLANK | Overcurrent protection blanking time (HW Variant) | 0.2 | µs | |||
tOCP_DEG | Overcurrent protection deglitch time (SPI Variant) | OCP_DEG = 00b | 0.2 | µs | ||
OCP_DEG = 01b | 0.5 | µs | ||||
OCP_DEG = 10b | 0.8 | µs | ||||
OCP_DEG = 11b | 1 | µs | ||||
tOCP_DEG | Overcurrent protection deglitch time (HW Variant) | 1 | µs | |||
tRETRY | Overcurrent protection retry time (SPI Variant) | FAST_RETRY = 00b | 0.24 | 0.5 | 0.65 | ms |
FAST_RETRY = 01b | 0.7 | 1 | 1.2 | ms | ||
FAST_RETRY = 10b | 1.6 | 2 | 2.2 | ms | ||
FAST_RETRY = 11b | 4.4 | 5 | 5.3 | ms | ||
SLOW_RETRY = 00b | 390 | 500 | 525 | ms | ||
SLOW_RETRY = 01b | 840 | 1000 | 1050 | ms | ||
SLOW_RETRY = 10b | 1700 | 2000 | 2200 | ms | ||
SLOW_RETRY = 11b | 4400 | 5000 | 5400 | ms | ||
tRETRY | Overcurrent protection retry time (HW Variant) | 5 | ms | |||
TOTW | Thermal warning temperature | Die temperature (TJ) Rising | 170 | 178 | 185 | °C |
TOTW_HYS | Thermal warning hysteresis | Die temperature (TJ) | 25 | 30 | °C | |
TTSD | Thermal shutdown temperature | Die temperature (TJ) Rising | 180 | 190 | 200 | °C |
TTSD_HYS | Thermal shutdown hysteresis | Die temperature (TJ) | 25 | 30 | °C | |
TTSD | Thermal shutdown temperature (LDO) | Die temperature (TJ) Rising | 180 | 190 | 200 | °C |
TTSD_HYS | Thermal shutdown hysteresis (LDO) | Die temperature (TJ) | 25 | 30 | °C | |
PWM OUTPUT ACCURACY (tSPI) | ||||||
RPWM | Output PWM Resolution | PWM FREQUENCY = 20 kHz | 10 | bits | ||
APWM | Output PWM Accuracy | VVM < 4.5V, PWM_SYNC and Clock Tuning Disabled | -7.5 | 7.5 | % | |
VVM > 4.5V, PWM_SYNC and Clock Tuning Disabled | -4 | 4 | % | |||
PWM_SYNC Enabled and Clock Tuning Disabled | -1 | 1 | % | |||
PWM_SYNC Disabled and SPISYNC_ACRCY = 11b | -2 | 2 | % | |||
PWM_SYNC Disabled and SPISYNC_ACRCY = 10b | -1 | 1 | % | |||
PWM_SYNC Disabled and SPISYNC_ACRCY = 01b | -1 | 1 | % | |||
PWM_SYNC Disabled and SPISYNC_ACRCY = 00b | -1 | 1 | % |