JAJSHI4 May   2019 DRV8340-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     概略回路図
  4. 4 改訂履歴
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1. Table 1. Pin Functions—DRV8340H
    2. Table 2. Pin Functions—DRV8340S
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Three Phase Smart Gate Drivers
        1. 8.3.1.1 PWM Control Modes
          1. 8.3.1.1.1 6x PWM Mode (PWM_MODE = 000b or MODE Pin Tied to AGND)
          2. 8.3.1.1.2 3x PWM Mode (PWM_MODE = 001b or MODE Pin = 18 kΩ to AGND)
          3. 8.3.1.1.3 1x PWM Mode (PWM_MODE = 010b or MODE Pin = 75 kΩ to AGND)
          4. 8.3.1.1.4 Independent Half-Bridge PWM Mode (PWM_MODE = 011b or MODE Pin is > 1.5 MΩ to AGND or Hi-Z)
          5. 8.3.1.1.5 Phases A and B are Independent Half-Bridges, Phase C is Independent FET (MODE = 100b)
          6. 8.3.1.1.6 Phases B and C are Independent Half-Bridges, Phase A is Independent FET (MODE = 101b or MODE Pin is 75 kΩ to DVDD)
          7. 8.3.1.1.7 Phases A is Independent Half-Bridge, Phases B and C are Independent FET (MODE = 110b or MODE Pin is 18 kΩ to DVDD)
          8. 8.3.1.1.8 Independent MOSFET Drive Mode (PWM_MODE = 111b or MODE Pin = 0.47 kΩ to DVDD)
        2. 8.3.1.2 Device Interface Modes
          1. 8.3.1.2.1 Serial Peripheral Interface (SPI)
          2. 8.3.1.2.2 Hardware Interface
        3. 8.3.1.3 Gate Driver Voltage Supplies
        4. 8.3.1.4 Smart Gate Drive Architecture
          1. 8.3.1.4.1 IDRIVE: MOSFET Slew-Rate Control
          2. 8.3.1.4.2 TDRIVE: MOSFET Gate Drive Control
          3. 8.3.1.4.3 Propagation Delay
          4. 8.3.1.4.4 MOSFET VDS Monitors
          5. 8.3.1.4.5 VDRAIN Sense Pin
          6. 8.3.1.4.6 nFAULT Pin
      2. 8.3.2 DVDD Linear Voltage Regulator
      3. 8.3.3 Pin Diagrams
      4. 8.3.4 Gate Driver Protective Circuits
        1. 8.3.4.1 VM Supply Undervoltage Lockout (UVLO)
        2. 8.3.4.2 VCP Charge Pump Undervoltage Lockout (CPUV)
        3. 8.3.4.3 MOSFET VDS Overcurrent Protection (VDS_OCP)
          1. 8.3.4.3.1 VDS Latched Shutdown (OCP_MODE = 00b)
          2. 8.3.4.3.2 VDS Automatic Retry (OCP_MODE = 01b)
          3. 8.3.4.3.3 VDS Report Only (OCP_MODE = 10b)
          4. 8.3.4.3.4 VDS Disabled (OCP_MODE = 11b)
        4. 8.3.4.4 Gate Driver Fault (GDF)
        5. 8.3.4.5 Thermal Warning (OTW)
        6. 8.3.4.6 Thermal Shutdown (OTSD)
          1. 8.3.4.6.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 8.3.4.6.2 Automatic Recovery (OTSD_MODE = 1b)
        7. 8.3.4.7 Open Load Detection (OLD)
          1. 8.3.4.7.1 Open Load Detection in Passive Mode (OLP)
            1. 8.3.4.7.1.1 OLP Steps
          2. 8.3.4.7.2 Open Load Detection in Active Mode (OLA)
        8. 8.3.4.8 Offline Shorts Diagnostics
          1. 8.3.4.8.1 Offline Short-to-Supply Diagnostic (SHT_BAT)
          2. 8.3.4.8.2 Offline Short-to-Ground Diagnostic (SHT_GND)
        9. 8.3.4.9 Reverse Supply Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Gate Driver Functional Modes
        1. 8.4.1.1 Sleep Mode
        2. 8.4.1.2 Operating Mode
        3. 8.4.1.3 Fault Reset (CLR_FLT or ENABLE Reset Pulse)
    5. 8.5 Programming
      1. 8.5.1 SPI Communication
        1. 8.5.1.1 SPI
          1. 8.5.1.1.1 SPI Format
    6. 8.6 Register Maps
      1. 8.6.1 Status Registers
        1. 8.6.1.1 FAULT Status Register (Address = 0x00) [reset = 0x00]
          1. Table 17. FAULT Status Register Field Descriptions
        2. 8.6.1.2 DIAG Status A Register (Address = 0x01) [reset = 0x00]
          1. Table 18. DIAG Status A Register Field Descriptions
        3. 8.6.1.3 DIAG Status B Register (Address = 0x02) [reset = 0x00]
          1. Table 19. DIAG Status B Register Field Descriptions
        4. 8.6.1.4 DIAG Status C Register (address = 0x03) [reset = 0x00]
          1. Table 20. DIAG Status C Register Field Descriptions
      2. 8.6.2 Control Registers
        1. 8.6.2.1  IC1 Control Register (Address = 0x04) [reset = 0x00]
          1. Table 22. IC1 Control Field Descriptions
        2. 8.6.2.2  IC2 Control Register (address = 0x05) [reset = 0x40]
          1. Table 23. IC2 Control Field Descriptions
        3. 8.6.2.3  IC3 Control Register (Address = 0x06) [reset = 0xFF]
          1. Table 24. IC3 Control Field Descriptions
        4. 8.6.2.4  IC4 Control Register (Address = 0x07) [reset = 0xFF]
          1. Table 25. IC4 Control Field Descriptions
        5. 8.6.2.5  IC5 Control Register (Address = 0x08) [reset = 0xFF]
          1. Table 26. IC5 Control Field Descriptions
        6. 8.6.2.6  IC6 Control Register (Address = 0x09) [reset = 0x99]
          1. Table 27. IC6 Control Field Descriptions
        7. 8.6.2.7  IC7 Control Register (Address = 0x0A) [reset = 0x99]
          1. Table 28. IC7 Control Field Descriptions
        8. 8.6.2.8  IC8 Control Register (Address = 0x0B) [reset = 0x99]
          1. Table 29. IC8 Control Field Descriptions
        9. 8.6.2.9  IC9 Control Register (Address = 0x0C) [reset = 0x2F]
          1. Table 30. IC9 Control Field Descriptions
        10. 8.6.2.10 IC10 Control Register (Address = 0x0D) [reset = 0x61]
          1. Table 31. IC10 Control Field Descriptions
        11. 8.6.2.11 IC11 Control Register (Address = 0x0E) [reset = 0x00]
          1. Table 32. IC11 Control Field Descriptions
        12. 8.6.2.12 IC12 Control Register (Address = 0x0F) [reset = 0x2A]
          1. Table 33. IC12 Control Field Descriptions
        13. 8.6.2.13 IC13 Control Register (Address = 0x10) [reset = 0x7F]
          1. Table 34. IC13 Control Field Descriptions
        14. 8.6.2.14 IC14 Control Register (Address = 0x10) [reset = 0x00]
          1. Table 35. IC14 Control Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Primary Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 External MOSFET Support
            1. 9.2.1.2.1.1 Example
          2. 9.2.1.2.2 IDRIVE Configuration
            1. 9.2.1.2.2.1 Example
          3. 9.2.1.2.3 VDS Overcurrent Monitor Configuration
            1. 9.2.1.2.3.1 Example
          4. 9.2.1.2.4 Design consideration of low-side gate drive (IDRIVE, GLx, SLx)
          5. 9.2.1.2.5 External Components
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Consideration in Generator Mode
    2. 10.2 Bulk Capacitance Sizing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デバイスの項目表記
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.3.4.7.2 Open Load Detection in Active Mode (OLA)

An open load in active mode is disabled by default in the SPI device and can be enabled independently per half-bridge by writing a 1 to the EN_OLA_x bit. In the H/W device, OLA runs if the nDIAG pin is left as unconnected or tied to GND. OLA is detected when the motor gets disconnected from the driver when it is commutating. Figure 30 shows a simplified H-bridge configuration for OLA implementation during high-side current recirculation. When the voltage drop across the body diode of the MOSFET does not exhibit overshoot greater than the VOLA over VM between the time the low-side FET is switched off and the high side FET is switched on during an output PWM cycle. An open load is not detected if the energy stored in the inductor is high enough to cause an overshoot greater than the VOLA over VM caused by the fly-back current flowing through the body diode of the high-side FET.

DRV8340-Q1 drv8323-q1-h-bridge-diode-hysteresis.gifFigure 30. Circuit for Open Load Detection in Active Mode

NOTE

Depending on the operating conditions and on external circuitry, such as the output capacitors, an open load could be reported even though the load is present. This case might occur during a direction change or for small load currents respectively small PWM duty cycles. Therefore, TI recommends evaluating the open load diagnosis only in known suitable operating conditions and to ignore it otherwise.

The device has a failure counter to avoid inadvertent triggering of the open load active diagnosis. Three consecutive occurrences of the internal open load signal must occur, essentially three consecutive PWM pulses without freewheeling detected, before an open load is reported through the nFAULT pin and in the respective SPI register.

In the SPI device, depending on the load configuration and the PWM sequence, OLA on one phase can latch all three OL_PH_x bits high. In that case, the OLP diagnostic can be initiated to determine which phase has the open load condition. The load connections shown in Figure 29 are not supported by OLA.

For OLA to function correctly, place capacitors between the motor phase node and GND. This capacitor is required for BLDC, bi-directional BDC and unidirectional BDC motors at the phase node. If a solenoid load is connected, as shown in Figure 15, the capacitor is not required. Size the capacitors according Equation 3. Make sure that the capacitor (Cphase) is placed on the PCB.

Equation 3. DRV8340-Q1 drv8323-q1-phase-capacitor-equation.gif

where

  • VTH is the threshold voltage of the MOSFET.
  • VOLA(min) is 150 mV.

The values of Crss and Coss of the MOSFETs should be used for 0-V VDS. Derating of Cphase must be considered when selecting the capacitance.