SLVSHA4 June   2024 DRV8421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Comm
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Truth Tables
      3. 7.3.3 Parallel Operation
      4. 7.3.4 Protection Circuits
        1. 7.3.4.1 OCP
        2. 7.3.4.2 TSD
        3. 7.3.4.3 UVLO
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance Sizing
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Community Resources
    2. 9.2 Trademarks
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

Over operating free-air temperature range referenced with respect to GND (unless otherwise noted)(1)
MIN MAX UNIT
Power supply voltage (VM) -0.3 20 V
Power supply voltage ramp rate (VM) 0 2 V/µs
Control pin voltage (IN1, IN2, IN3, IN4, EN, nFAULT) -0.3 7 V
Continuous phase node pin voltage (OUT1, OUT2, OUT3, OUT4) -0.3 VVM + 0.6 V
Peak drive current (OUT1, OUT2, OUT3, OUT4) Internally limited A
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.