JAJSPD5C June   2011  – December 2022 DRV8662

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fast Start-up (Enable Pin)
      2. 7.3.2 Gain Control
      3. 7.3.3 Adjustable Boost Voltage
      4. 7.3.4 Adjustable Boost Current Limit
      5. 7.3.5 Internal Charge Pump
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Startup/shutdown Sequencing
        1. 7.4.1.1 PWM Source
        2. 7.4.1.2 DAC Source
      2. 7.4.2 Low-voltage Operation
    5. 7.5 Programming
      1. 7.5.1 Programming the Boost Voltage
      2. 7.5.2 Programing the Boost Current Limit
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRV8662 System Diagram with DAC Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Piezo Actuator Selection
          3. 8.2.1.2.3 Boost Capacitor Selection
          4. 8.2.1.2.4 Current Consumption Calculation
          5. 8.2.1.2.5 Input Filter Considerations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DRV8662 System Diagram with Filtered Single-Ended PWM Input
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Input Filter Design
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

  • To achieve optimum device performance, use of the thermal footprint outlined by this datasheet is recommended. See land pattern diagram for exact dimensions. The DRV8662 power pad must be soldered directly to the thermal pad on the printed circuit board. The printed circuit board thermal pad should be connected to the ground net with thermal vias to any existing backside/internal copper ground planes. Connection to a ground plane on the top layer near the corners of the device is also recommended.
  • Another key layout consideration is to keep the boost programming resistors (R1 and R2) as close as possible to the FB pin of the DRV8662. Care should be taken to avoid getting the FB trace near the SW trace.