SNLS243H September   2006  – March 2016 DS25MB100

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CML Inputs and EQ
      2. 8.3.2 Multiplexer and Loopback Control
      3. 8.3.3 CML Drivers and Pre-Emphasis Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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10 Power Supply Recommendations

The supply (VCC) and ground (GND) pins must be connected to power planes routed on adjacent layers of the printed-circuit board. The layer thickness of the dielectric must be minimized so that the VCC and GND planes create a low inductance supply with distributed capacitance. Careful attention to supply bypassing through the proper use of bypass capacitors is required. A 0.01-μF or 0.1-μF bypass capacitor must be connected to each VCC pin such that the capacitor is placed as close as possible to the VCC pins. Smaller body size capacitors, such as 0402 body size, can help facilitate proper component placement. Refer to the VCC pin connections in Figure 11 for further details.