JAJSJZ3 june   2023 DS320PR1601

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD and Latchup Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 High Speed Electrical Characteristics
    7. 6.7 SMBUS/I2C Timing Characteristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Jitter Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Linear Equalization
      2. 7.3.2 Flat-Gain
      3. 7.3.3 Receiver Detect State Machine
      4. 7.3.4 Five-Level Control Inputs
      5. 7.3.5 Integrated Capacitors
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active PCIe Mode
      2. 7.4.2 Active Buffer Mode
      3. 7.4.3 Standby Mode
  9. 8 Programming
    1. 8.1 Pin Configurations for Lanes
    2. 8.2 SMBUS/I2C Register Control Interface
      1. 8.2.1 Shared Registers
      2. 8.2.2 Channel Registers
    3. 8.3 SMBus/I 2 C Controller Mode Configuration (EEPROM Self Load)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 PCIe x16 Lane Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) DS320PR1601 UNIT
ZDG (nfBGA, 354)
RθJA-High K Junction-to-ambient thermal resistance 17.4 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 6.5 ℃/W
RθJB Junction-to-board thermal resistance 6.1 ℃/W
ψJT Junction-to-top characterization parameter 3.6 ℃/W
ψJB Junction-to-board characterization parameter 5.9 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A ℃/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.