JAJSHF5 May   2019 DS90UB949A-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  DC Electrical Characteristics
    6. 7.6  AC Electrical Characteristics
    7. 7.7  DC and AC Serial Control Bus Characteristics
    8. 7.8  Recommended Timing for the Serial Control Bus
    9. 7.9  Timing Diagrams
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  High-Definition Multimedia Interface (HDMI)
        1. 8.3.1.1 HDMI Receive Controller
      2. 8.3.2  Transition Minimized Differential Signaling
      3. 8.3.3  Enhanced Display Data Channel
      4. 8.3.4  Extended Display Identification Data (EDID)
        1. 8.3.4.1 External Local EDID (EEPROM)
        2. 8.3.4.2 Internal EDID (SRAM)
        3. 8.3.4.3 External Remote EDID
        4. 8.3.4.4 Internal Pre-Programmed EDID
      5. 8.3.5  Consumer Electronics Control (CEC)
      6. 8.3.6  +5-V Power Signal
      7. 8.3.7  Hot Plug Detect (HPD)
      8. 8.3.8  High-Speed Forward Channel Data Transfer
      9. 8.3.9  Back Channel Data Transfer
      10. 8.3.10 FPD-Link III Port Register Access
      11. 8.3.11 Power Down (PDB)
      12. 8.3.12 Serial Link Fault Detect
      13. 8.3.13 Interrupt Pin (INTB)
      14. 8.3.14 Remote Interrupt Pin (REM_INTB)
      15. 8.3.15 General-Purpose I/O
        1. 8.3.15.1 GPIO[3:0] and D_GPIO[3:0] Configuration
        2. 8.3.15.2 Back Channel Configuration
        3. 8.3.15.3 GPIO_REG[8:5] Configuration
      16. 8.3.16 SPI Communication
        1. 8.3.16.1 SPI Mode Configuration
        2. 8.3.16.2 Forward-Channel SPI Operation
        3. 8.3.16.3 Reverse Channel SPI Operation
      17. 8.3.17 Backward Compatibility
      18. 8.3.18 Audio Modes
        1. 8.3.18.1 HDMI Audio
        2. 8.3.18.2 DVI I2S Audio Interface
          1. 8.3.18.2.1 I2S Transport Modes
          2. 8.3.18.2.2 I2S Repeater
        3. 8.3.18.3 AUX Audio Channel
        4. 8.3.18.4 TDM Audio Interface
      19. 8.3.19 Built-In Self Test (BIST)
        1. 8.3.19.1 BIST Configuration and Status
        2. 8.3.19.2 Forward-Channel and Back-Channel Error Checking
      20. 8.3.20 Internal Pattern Generation
        1. 8.3.20.1 Pattern Options
        2. 8.3.20.2 Color Modes
        3. 8.3.20.3 Video Timing Modes
        4. 8.3.20.4 External Timing
        5. 8.3.20.5 Pattern Inversion
        6. 8.3.20.6 Auto Scrolling
        7. 8.3.20.7 Additional Features
      21. 8.3.21 Spread-Spectrum Clock Tolerance
    4. 8.4 Device Functional Modes
      1. 8.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 8.4.2 FPD-Link III Modes of Operation
        1. 8.4.2.1 Single-Link Operation
        2. 8.4.2.2 Dual-Link Operation
        3. 8.4.2.3 Replicate Mode
        4. 8.4.2.4 Auto-Detection of FPD-Link III Modes
        5. 8.4.2.5 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 8.5 Programming
      1. 8.5.1 Serial Control Bus
      2. 8.5.2 Multi-Master Arbitration Support
      3. 8.5.3 I2C Restrictions on Multi-Master Operation
      4. 8.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 8.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 8.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
      7. 8.5.7 Prevention of I2C Faults During Abrupt System Faults
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Applications Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 High-Speed Interconnect Guidelines
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Requirements and PDB Pin
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.5 DC Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS PIN/FREQ. MIN TYP MAX UNIT
1.8-V LVCMOS I/O
VIH High level input voltage SCLK/I2CSEL, PDB, D_GPIO0/MOSI, D_GPIO1/MISO, D_GPIO2/SPLK, D_GPIO3/SS, SDIN/GPIO0, SWC/GPIO1, MCLK I2S_DC/GPIO2, I2S_DD/GPIO3, I2S_DB/GPIO5_REG, I2S_DA/GPIO6_REG, I2S_CLK/GPIO8_REG, I2S_WC/GPIO7_REG 0.65 × VDDIO V
VIL Low level input voltage 0 0.35 × VDDIO V
IIN Input current VIN = 0 V or 1.89 V −10 10 μA
VOH High level output voltage IOH = –4 mA 0.7 × VDDIO VDDIO V
VOL Low level output voltage IOL = 4 mA GND 0.26 × VDDIO V
IOS Output short-circuit current VOUT = 0 V –50 mA
IOZ TRI-STATE output current VOUT = 0 V or VDDIO, PDB = L –10 10 μA
TMDS INPUTS -- FROM HDMI v1.4b SECTION 4.2.5
VICM1 Input common-mode voltage IN_CLK ≤ 210 MHz IN_D[2:0]+, IN_D[2:0]–
IN_CLK+, IN_CLK–
VTERM = 1.8 V (±5%) or VTERM = 3.3 V (±5%)		 VTERM – 400 VTERM – 37.5 mV
VICM2 Input common-mode voltage IN_CLK ≤ 210 MHz VTERM – 10 VTERM + 10 mV
VIDIFF Input differential voltage level IN_CLK ≤ 210 MHz 150 1200 mVP-P
RTMDS Termination resistance Differential IN_D[2:0]+, IN_D[2:0]–
IN_CLK+, IN_CLK–		 90 100 110 Ω
HDMI IO -- FROM HDMI v1.4b SECTION 4.2.7 to 4.2.9
VRX_5V 5-V power signal RX_5V 4.8 5.3 V
I5V_Sink 5-V input current 55 mA
VOH,HPD High level output voltage, HPD IOH = –4 mA HPD, RPU = 1 kΩ 2.4 5.3 V
VOL,HPD Low level output voltage, HPD IOL = 4 mA GND 0.4 V
IIZ,HPD Power-down input current, HPD PDB = L –10 10 uA
VIL,DDC Low level input voltage, DDC DDC_SCL, DDC_SDA 0.3 × VDD,DDC V
VIH,DDC High level input voltage, DDC 2.7 V
IIZ,DDC Power-down input current, DDC PDB = L –10 10 µA
VIH,CEC High level input voltage, CEC CEC 2 V
VIL,CEC Low level input voltage, CEC 0.8 V
VHY,CEC Input hysteresis, CEC 0.4 V
VOL,CEC Low level output voltage, CEC GND 0.6 V
VOH,CEC High level output voltage, CEC 2.5 3.63 V
IOFF_CEC Power-down input current, CEC PDB = L –1.8 1.8 µA
FPD-LINK III DIFFERENTIAL DRIVER
VODp-p Output differential voltage DOUT[1:0]+, DOUT[1:0]– 900 1200 mVp-p
ΔVOD Output voltage unbalance 1 50 mV
VOS Output differential offset voltage 550 mV
ΔVOS Offset voltage unbalance 1 50 mV
IOS Output short-circuit current FPD-Link III outputs = 0 V –50 mA
RT Termination resistance Single-ended 40 50 60 Ω
SUPPLY CURRENT(1)
IDD11 Supply current, normal operation Colorbar pattern 300 510 mA
IDD18 Supply current, normal operation 25 50
IDD,VTERM VTERM current, normal operation 60 mA
IDDZ11 Supply current, power-down mode PDB = L 15 mA
IDDZ18 Supply current, power-down mode 5
IDDZ,VTERM VTERM current, power-down mode 5 mA
(1) Specification is ensured by bench characterization.