JAJSOL1A April   2022  – July 2022 ESD341

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1.     Absolute Maximum Ratings
    2. 6.1 ESD Ratings—JEDEC Specification
    3. 6.2 ESD Ratings—IEC Specification
    4.     Recommended Operating Conditions
    5. 6.3 Thermal Information
    6. 6.4 Electrical Characteristics
    7. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IEC 61000-4-2 ESD Protection
      2. 7.3.2 IEC 61000-4-5 Surge Protection
      3. 7.3.3 IO Capacitance
      4. 7.3.4 DC Breakdown Voltage
      5. 7.3.5 Ultra Low Leakage Current
      6. 7.3.6 Low ESD Clamping Voltage
      7. 7.3.7 Supports High Speed Interfaces
      8. 7.3.8 Industrial Temperature Range
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range
        2. 8.2.2.2 Operating Frequency
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DPL|2
サーマルパッド・メカニカル・データ
発注情報

7.3.7 Supports High Speed Interfaces

This device is capable of supporting high speed interfaces up to 3.4 Gbps, because of the extremely low IO capacitance.